LCMXO3L-9400E-6MG256C
IC FPGA 206 I/O 256CSFBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-VFBGA, CSPBGA
- 庫存
- 1,334 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 256-CSFBGA (9x9) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3L-9400E-6MG256C 的主要供貨及採購資訊。
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LCMXO3L-9400E-6MG256C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO3L-9400E-6MG256C is a MachXO3 field programmable gate array for embedded logic and I/O expansion tasks in board-level designs. It uses a 256-VFBGA, CSPBGA package, with a 256-CSFBGA (9x9) device package, and surface mount. The device provides 206 I/O pins, 9,400 logic elements or cells, 1,175 LABs or CLBs, and 442,368 total RAM bits. Its specified voltage supply range is 1.14V to 1.26V, and its operating temperature range is 0°C to 85°C at the junction. These characteristics define the available logic, I/O, memory, power, and thermal conditions for programmable glue logic, peripheral interfacing, and custom control functions in a BGA footprint.
Key Features
- MachXO3 FPGA with 9,400 logic elements or cells and 1,175 LABs or CLBs.
- 206 I/O pins for interface expansion and board-level signal routing.
- 442,368 total RAM bits for on-device data storage and buffering.
- Voltage supply range of 1.14V to 1.26V.
- Operating temperature range of 0°C to 85°C at the junction.
- 256-VFBGA, CSPBGA package with 256-CSFBGA (9x9) device package and surface mount.
Applications
- Programmable glue logic between microcontrollers, sensors, and peripheral devices.
- Custom control logic in embedded systems that require configurable I/O and on-chip RAM.
- Interface adaptation using configurable logic and the 206 available I/O pins.
Design & Procurement Notes
Designers should plan the power supply to meet the 1.14V to 1.26V range and consider the 0°C to 85°C junction temperature limit when evaluating thermal conditions. The 256-VFBGA, CSPBGA package with a 256-CSFBGA (9x9) footprint and surface mount assembly requires BGA land pattern, paste stencil, and reflow process compatibility. The 206 I/O pins, 9,400 logic elements or cells, 1,175 LABs or CLBs, and 442,368 total RAM bits should be used as the basis for logic, interface, and memory resource allocation in the system design.
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