料號

LCMXO3L-9400E-5BG484I

IC FPGA 384 I/O 484CABGA

封裝
484-LFBGA
庫存
1,345 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package Tray
Product status Active
Series MachXO3
Supplier Device Package 484-CABGA (19x19)
Voltage - Supply 1.14V ~ 1.26V
資料表 查看資料表PDF
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料號 LCMXO3L-9400E-5BG484I
供貨狀態 列示庫存 1,345 pcs 當前數量需確認。
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LCMXO3L-9400E-5BG484I 詳細描述

Product Overview

The LCMXO3L-9400E-5BG484I is a Lattice Semiconductor Corporation MachXO3 field programmable gate array intended for embedded logic and input/output control tasks. It provides 9400 logic elements or cells, 1175 LABs or CLBs, 442368 total RAM bits, and 384 I/O pins. The device uses a 484-LFBGA package, with a 484-CABGA (19x19) package designation, and is mounted by surface mount techniques. Its specified supply voltage range is 1.14V to 1.26V, and its operating junction temperature range is -40°C to 100°C.

Key Features

  • MachXO3 FPGA architecture with 9400 logic elements or cells
  • 1175 LABs or CLBs for configurable logic organization
  • 442368 total RAM bits available for on-device storage and buffering
  • 384 I/O pins for interfacing with external devices and subsystems
  • Supply voltage range of 1.14V to 1.26V
  • Operating temperature range of -40°C to 100°C (TJ)
  • Surface mount package: 484-LFBGA, with 484-CABGA (19x19) package designation

Applications

  • Configurable control logic in embedded equipment
  • Glue logic replacement for digital subsystems
  • Signal routing and I/O expansion across many I/O pins
  • Temporary data storage and buffering using available RAM bits
  • Programmable interface logic between system components and external hardware

Design & Procurement Notes

When selecting the LCMXO3L-9400E-5BG484I, compare the required logic capacity, RAM bits, and I/O count against the 9400 logic elements or cells, 442368 total RAM bits, and 384 I/O pins. The 1.14V to 1.26V supply range should be included in power budget and regulator selection, while the -40°C to 100°C junction temperature range supports thermal planning for the board environment. The 484-LFBGA and 484-CABGA (19x19) package requires a compatible surface mount footprint, reflow process, and PCB land pattern. Designers should also verify pin assignment, signal integrity, and power distribution for the 384 I/O pins during schematic and layout development.

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