料號

LCMXO3L-9400C-6BG484C

IC FPGA 384 I/O 484CABGA

封裝
484-LFBGA
庫存
1,439 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package Tray
Product status Active
Series MachXO3
Supplier Device Package 484-CABGA (19x19)
Voltage - Supply 2.375V ~ 3.465V
資料表 查看資料表PDF
採購資訊

採購概覽

LCMXO3L-9400C-6BG484C 的主要供貨及採購資訊。

查詢價格及供貨
料號 LCMXO3L-9400C-6BG484C
供貨狀態 列示庫存 1,439 pcs 當前數量需確認。
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LCMXO3L-9400C-6BG484C 詳細描述

Product Overview

The LCMXO3L-9400C-6BG484C from Lattice Semiconductor Corporation is a MachXO3 FPGA integrated circuit. It is offered in a 484-LFBGA package case, with a 484-CABGA (19x19) surface-mount device package. The device provides 384 input/output pins, 9400 logic elements/cells, 1175 LABs/CLBs, and 442368 total RAM bits. It operates from a 2.375 V to 3.465 V supply and is specified for a 0°C to 85°C junction temperature range.

Key Features

  • MachXO3 FPGA family device with 9400 logic elements/cells and 1175 LABs/CLBs.
  • 384 I/O pins are available for system connectivity and interface implementation.
  • 442368 total RAM bits provide on-chip storage for logic and data handling.
  • 484-LFBGA package case and 484-CABGA (19x19) surface-mount device package.
  • 2.375 V to 3.465 V supply range and 0°C to 85°C junction temperature range.

Applications

  • Embedded control logic in general-purpose electronic systems.
  • Interface bridging between digital subsystems using available I/O pins.
  • Peripheral expansion in designs that require custom logic functions.
  • Data formatting or buffering tasks using on-chip RAM bits.

Design & Procurement Notes

For board design, confirm the 484-LFBGA package case, 484-CABGA (19x19) pad layout, and surface-mount assembly process. Keep supply voltage within 2.375 V to 3.465 V and account for the 0°C to 85°C junction temperature limit in thermal planning. Use the 384 I/O count, 9400 logic elements/cells, 1175 LABs/CLBs, and 442368 total RAM bits to assess whether the device meets the required connectivity, logic capacity, and on-chip storage needs before selection. Verify the final footprint and thermal characteristics against the selected package and operating conditions.

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