LCMXO3L-9400C-6BG484C
IC FPGA 384 I/O 484CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 484-LFBGA
- 庫存
- 1,439 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 484-CABGA (19x19) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3L-9400C-6BG484C 的主要供貨及採購資訊。
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LCMXO3L-9400C-6BG484C 詳細描述
Product Overview
The LCMXO3L-9400C-6BG484C from Lattice Semiconductor Corporation is a MachXO3 FPGA integrated circuit. It is offered in a 484-LFBGA package case, with a 484-CABGA (19x19) surface-mount device package. The device provides 384 input/output pins, 9400 logic elements/cells, 1175 LABs/CLBs, and 442368 total RAM bits. It operates from a 2.375 V to 3.465 V supply and is specified for a 0°C to 85°C junction temperature range.
Key Features
- MachXO3 FPGA family device with 9400 logic elements/cells and 1175 LABs/CLBs.
- 384 I/O pins are available for system connectivity and interface implementation.
- 442368 total RAM bits provide on-chip storage for logic and data handling.
- 484-LFBGA package case and 484-CABGA (19x19) surface-mount device package.
- 2.375 V to 3.465 V supply range and 0°C to 85°C junction temperature range.
Applications
- Embedded control logic in general-purpose electronic systems.
- Interface bridging between digital subsystems using available I/O pins.
- Peripheral expansion in designs that require custom logic functions.
- Data formatting or buffering tasks using on-chip RAM bits.
Design & Procurement Notes
For board design, confirm the 484-LFBGA package case, 484-CABGA (19x19) pad layout, and surface-mount assembly process. Keep supply voltage within 2.375 V to 3.465 V and account for the 0°C to 85°C junction temperature limit in thermal planning. Use the 384 I/O count, 9400 logic elements/cells, 1175 LABs/CLBs, and 442368 total RAM bits to assess whether the device meets the required connectivity, logic capacity, and on-chip storage needs before selection. Verify the final footprint and thermal characteristics against the selected package and operating conditions.
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