LCMXO3L-6900E-6MG256I
IC FPGA 206 I/O 256CSFBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-VFBGA, CSPBGA
- 庫存
- 1,414 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 256-CSFBGA (9x9) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
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LCMXO3L-6900E-6MG256I 的主要供貨及採購資訊。
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LCMXO3L-6900E-6MG256I 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO3L-6900E-6MG256I is a MachXO3 field programmable gate array supplied in a 256-VFBGA, CSPBGA package with a 256-CSFBGA (9x9) device package. It is intended for surface-mount embedded designs that require configurable logic, on-chip memory, and a broad I/O count. The device provides 858 LABs/CLBs, 6864 logic elements/cells, 245760 total RAM bits, and 206 I/O pins, while operating from a 1.14 V to 1.26 V supply over a junction temperature range of -40°C to 100°C.
Key Features
- MachXO3 FPGA with 858 LABs/CLBs and 6864 logic elements/cells for configurable embedded logic.
- 245760 total RAM bits provide on-chip memory capacity.
- 206 I/O pins support external interface connections.
- Surface-mount 256-VFBGA, CSPBGA package with 256-CSFBGA (9x9) device package.
- 1.14 V to 1.26 V supply operating range.
- -40°C to 100°C junction temperature range.
Applications
- Embedded control logic implementation in systems requiring configurable digital functions.
- Peripheral bridging and custom I/O expansion using the 206 available I/O pins.
- On-chip data buffering for embedded datapaths using 245760 total RAM bits.
- Surface-mount FPGA integration in designs with a 1.14 V to 1.26 V supply and -40°C to 100°C junction temperature budget.
Design & Procurement Notes
For design and procurement, confirm that the board supply can maintain 1.14 V to 1.26 V and that thermal conditions keep junction temperature within -40°C to 100°C. The 256-VFBGA, CSPBGA package with 256-CSFBGA (9x9) device package requires surface-mount layout and footprint planning. Resource sizing should account for 858 LABs/CLBs, 6864 logic elements/cells, 245760 total RAM bits, and 206 I/O pins when evaluating logic, memory, and external interface requirements.
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