LCMXO3L-6900E-5MG256I
IC FPGA 206 I/O 256CSFBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-VFBGA, CSPBGA
- 庫存
- 1,395 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 256-CSFBGA (9x9) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3L-6900E-5MG256I 的主要供貨及採購資訊。
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LCMXO3L-6900E-5MG256I 詳細描述
Product Overview
The LCMXO3L-6900E-5MG256I from Lattice Semiconductor Corporation is a MachXO3 field programmable gate array intended for embedded logic functions. It provides 6,864 logic elements, 858 LABs/CLBs, and 245,760 total RAM bits, giving designers configurable resources for control logic, interface management, and data buffering. The device exposes 206 I/Os in a 256-VFBGA, CSPBGA package, 256-CSFBGA (9x9) package, and it is surface mount. Its supply voltage range is specified as 1.14 V to 1.26 V, while the operating junction temperature range extends from -40°C to 100°C. The specified resources and I/O count support configurable digital logic, interface management, and on-chip data storage.
Key Features
- MachXO3 field programmable gate array from Lattice Semiconductor Corporation
- 6,864 logic elements and 858 LABs/CLBs
- 245,760 total RAM bits
- 206 I/Os
- 1.14 V to 1.26 V supply voltage range
- -40°C to 100°C operating junction temperature range
- 256-VFBGA, CSPBGA package, 256-CSFBGA (9x9) package
- Surface-mount mounting type
Applications
- Embedded control logic and finite state machines
- Sensor and actuator interface aggregation
- Data buffering and temporary storage management
- Custom glue logic and I/O expansion
- Programmable timing and sequencing functions
Design & Procurement Notes
Design teams should verify that the 1.14 V to 1.26 V supply range is compatible with the board power architecture and that the -40°C to 100°C junction temperature envelope covers worst-case thermal conditions. The 206 I/O count and 256-VFBGA, CSPBGA package require attention to PCB fanout, ball access, and thermal relief. The 245,760 total RAM bits and 6,864 logic elements should be mapped against the planned logic, buffering, and control functions before finalizing the design. Since the device is surface-mount, assembly flow and rework capability should align with the 256-CSFBGA (9x9) package.
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