LCMXO3L-6900C-6BG256I
IC FPGA 206 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA
- 庫存
- 1,351 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3L-6900C-6BG256I 的主要供貨及採購資訊。
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LCMXO3L-6900C-6BG256I 詳細描述
Product Overview
The LCMXO3L-6900C-6BG256I is a Lattice Semiconductor MachXO3 field programmable gate array offered in a 256-LFBGA package, identified as 256-CABGA (14x14), with surface-mount construction. It provides 206 I/O pins, 858 LABs/CLBs, 6864 logic elements/cells, and 245760 total RAM bits. The device operates from a 2.375V to 3.465V supply and is specified for a junction temperature range of -40°C to 100°C. The package is suitable for surface-mount assembly in compact embedded designs requiring reconfigurable logic.
Key Features
- MachXO3 FPGA with 6864 logic elements/cells and 858 LABs/CLBs.
- 245760 total RAM bits and 206 I/O.
- 256-LFBGA package identified as 256-CABGA (14x14).
- 2.375V to 3.465V supply voltage.
- -40°C to 100°C (TJ) operating temperature.
Applications
- Programmable digital logic control in embedded systems.
- Interface adaptation and I/O expansion between processors and peripherals.
- On-chip buffering and data routing using available RAM bits.
- Reconfigurable digital logic implementation in general electronic equipment.
Design & Procurement Notes
Designers should verify that the board stackup and land pattern support the 256-LFBGA / 256-CABGA (14x14) surface-mount package and that the power architecture can maintain the 2.375V to 3.465V supply under transient conditions. The 206 I/O count, 858 LABs/CLBs, 6864 logic elements/cells, and 245760 total RAM bits should be mapped against the planned logic, buffering, and interface requirements before finalizing the design. Thermal planning should consider the -40°C to 100°C (TJ) operating range, including package mounting, airflow, and routing density when multiple I/O are active.
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