LCMXO3L-6900C-5BG256I
IC FPGA 206 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA
- 庫存
- 1,354 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
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LCMXO3L-6900C-5BG256I 的主要供貨及採購資訊。
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LCMXO3L-6900C-5BG256I 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO3L-6900C-5BG256I is a MachXO3 field programmable gate array integrated circuit. It provides 206 input/output pins, 6,864 logic elements or cells, 858 logic array blocks or configurable logic blocks, and 245,760 total RAM bits. The surface-mount package is 256-CABGA (14x14), with a 256-LFBGA package/case designation. Its specified supply voltage range is 2.375 V to 3.465 V, and its operating temperature range is -40°C to 100°C junction temperature. As a programmable logic device, it can implement custom digital functions, interface logic, and embedded control structures within a single FPGA fabric.
Key Features
- MachXO3 FPGA architecture with 6,864 logic elements/cells and 858 LABs/CLBs.
- 245,760 total RAM bits for on-chip storage and buffering.
- 206 I/O pins for external signal connectivity.
- Supply voltage range of 2.375 V to 3.465 V.
- Operating temperature range of -40°C to 100°C (TJ).
- Surface-mount 256-CABGA (14x14) package with 256-LFBGA package/case designation.
Applications
- Implementing custom digital control logic in embedded systems.
- Providing interface logic between a processor and external peripherals.
- Replacing discrete logic functions with programmable glue logic.
- Hosting state machines and simple control sequencing functions.
- Buffering or organizing small amounts of data using on-chip RAM bits.
Design & Procurement Notes
Designers should verify that the 2.375 V to 3.465 V supply range matches the board power architecture and that the -40°C to 100°C junction temperature range is compatible with the thermal environment. The 256-CABGA (14x14) surface-mount package requires appropriate PCB land patterns, soldering process controls, and inspection methods for BGA assemblies. The 206 I/O count, 6,864 logic elements, 858 LABs/CLBs, and 245,760 RAM bits should be compared against the planned logic, memory, and pinout requirements before finalizing the architecture. Because the device is an FPGA, the programming and implementation flow should be considered during schematic and layout planning.
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