LCMXO3L-640E-5MG121I
IC FPGA 100 I/O 121CSFBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 121-VFBGA, CSPBGA
- 庫存
- 1,379 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 121-CSFBGA (6x6) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3L-640E-5MG121I 的主要供貨及採購資訊。
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LCMXO3L-640E-5MG121I 詳細描述
Product Overview
The LCMXO3L-640E-5MG121I from Lattice Semiconductor Corporation is a MachXO3 field programmable gate array (FPGA) intended for embedded logic implementation. The device provides 640 logic elements or cells, organized as 80 LABs or CLBs, along with 65536 total RAM bits and 100 I/O. It operates from a 1.14V to 1.26V supply and is rated for a junction temperature range of -40°C to 100°C. The part is supplied in a 121-VFBGA, CSPBGA package, with a 121-CSFBGA (6x6) device package, and uses surface-mount assembly. These characteristics support surface-mount subsystems where custom digital functions, buffering, and interface management are required.
Key Features
- MachXO3 FPGA architecture from Lattice Semiconductor Corporation.
- 640 logic elements or cells with 80 LABs or CLBs.
- 65536 total RAM bits for on-device memory resources.
- 100 I/O for external signal routing and interface connection.
- 1.14V to 1.26V supply voltage range.
- -40°C to 100°C junction operating temperature range.
- 121-VFBGA, CSPBGA package with 121-CSFBGA (6x6) device package.
- Surface-mount mounting type for PCB assembly.
Applications
- Embedded control logic in surface-mount subsystems where custom digital functions are required.
- Sensor and peripheral interface aggregation using available I/O and on-device RAM.
- Protocol bridging or signal formatting in board-level digital subsystems.
- Logic sequencing and state-machine implementation in temperature-aware embedded hardware.
Design & Procurement Notes
Design teams should verify that the system power supply maintains 1.14V to 1.26V under all operating conditions and that thermal management keeps the junction within -40°C to 100°C. The 121-VFBGA, CSPBGA package and 121-CSFBGA (6x6) device package require surface-mount layout and assembly considerations. With 100 I/O, 640 logic elements or cells, 80 LABs or CLBs, and 65536 total RAM bits, the device supports surface-mount embedded logic functions, but pin assignment and logic resource planning should be based on the selected design rather than package count alone.
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