LCMXO3L-4300C-6BG400C

Product Overview

The LCMXO3L-4300C-6BG400C is a Lattice Semiconductor Corporation MachXO3 field programmable gate array packaged in a 400-LFBGA case with a 400-CABGA (17x17) device package designation. It provides 335 I/O pins, 4320 logic elements or cells, 540 LABs or CLBs, and 94208 total RAM bits. The device is surface mount and operates from a supply voltage range of 2.375 V to 3.465 V, with an operating temperature range of 0°C to 85°C (TJ). These characteristics support configurable digital logic, signal routing, and on-chip memory use in embedded system designs.

Key Features

• MachXO3 FPGA family with 4320 logic elements or cells and 540 LABs or CLBs.
• 335 I/O pins are available for external interface, control, and data-path connections.
• 94208 total RAM bits provide on-chip storage for buffering or other memory functions.
• The supply voltage range is 2.375 V to 3.465 V for surface-mount FPGA operation.
• The 0°C to 85°C (TJ) operating temperature range requires junction-temperature-aware board design.
• The 400-LFBGA and 400-CABGA (17x17) package forms use a ball-grid-array footprint for surface-mount layouts.

Applications

• Embedded control systems requiring configurable digital logic and general-purpose I/O.
• Sensor data acquisition paths that route, buffer, or process multiple input signals.
• Protocol bridging between different digital interfaces or bus formats in system-level designs.
• Display, imaging, or video-related signal processing pipelines where programmable logic controls data movement and timing.
• Test and measurement equipment that needs custom logic, counters, or interface generation.

Design & Procurement Notes

When using the LCMXO3L-4300C-6BG400C, map the 4320 logic elements or cells, 540 LABs or CLBs, 94208 RAM bits, and 335 I/O pins early in the design to confirm that the resource budget matches the intended logic and interface plan. The 2.375 V to 3.465 V supply range should be reconciled with the system power architecture, and the 0°C to 85°C (TJ) limit should guide thermal budgeting and placement. Because the part uses a 400-LFBGA or 400-CABGA (17x17) ball-grid-array package, the PCB land pattern, via strategy, and routing density should be planned around the package. Select the exact manufacturer part number rather than assuming compatibility from the MachXO3 family.