LCMXO3L-4300C-6BG324I
IC FPGA 279 I/O 324CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 324-LFBGA
- 庫存
- 1,327 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 324-CABGA (15x15) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3L-4300C-6BG324I 的主要供貨及採購資訊。
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LCMXO3L-4300C-6BG324I 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO3L-4300C-6BG324I is a MachXO3 field programmable gate array for embedded logic and interface control functions. It uses a 324-LFBGA package, with a 324-CABGA (15 x 15) device package designation, and is mounted by surface-mount assembly. The device provides 279 I/O pins, 4320 logic elements, 540 LABs or CLBs, and 94208 total RAM bits. Its supply voltage range is 2.375 V to 3.465 V, and its operating junction temperature range is -40°C to 100°C.
Key Features
- MachXO3 FPGA architecture with 4320 logic elements and 540 LABs or CLBs.
- 279 I/O pins for external device connections.
- 94208 total RAM bits for on-device storage.
- Supply voltage range of 2.375 V to 3.465 V.
- Operating junction temperature range of -40°C to 100°C.
- 324-LFBGA surface-mount package with 324-CABGA (15 x 15) device package designation.
Applications
- Embedded control logic in equipment that requires programmable state machines and glue logic.
- Interface bridging between processors, memories, and peripherals where flexible I/O mapping is needed.
- Sensor aggregation and data formatting for systems with multiple inputs.
- Timing, sequencing, and bus translation functions in programmable hardware designs.
Design & Procurement Notes
When selecting this device, confirm that the board layout and assembly process support the 324-LFBGA or 324-CABGA surface-mount package. Compare the design's required logic elements, LAB or CLB count, RAM bits, and I/O count with the specified resources before implementation. Maintain the supply rail within 2.375 V to 3.465 V, and keep the expected junction temperature within -40°C to 100°C. Because the package provides 279 I/O pins, plan pin assignment and signal grouping early to reduce later board routing changes.
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