LCMXO3L-2100E-5MG256C
IC FPGA 206 I/O 256CSFBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-VFBGA, CSPBGA
- 庫存
- 1,331 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 256-CSFBGA (9x9) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3L-2100E-5MG256C 的主要供貨及採購資訊。
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LCMXO3L-2100E-5MG256C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO3L-2100E-5MG256C is a MachXO3 field programmable gate array (FPGA) for embedded logic tasks. It provides 2,112 logic elements/cells, 264 LABs/CLBs, and 75,776 total RAM bits, forming a compact programmable fabric for control, routing, and buffering functions. The device offers 206 I/O pins and uses a 256-VFBGA, CSPBGA package, with the 256-CSFBGA (9x9) package designation. It is a surface-mount device operating from a 1.14 V to 1.26 V supply over a 0°C to 85°C (TJ) junction temperature range.
Key Features
- 2,112 logic elements/cells and 264 LABs/CLBs define the available programmable logic capacity.
- 75,776 total RAM bits provide on-chip buffering and small data storage resources.
- 206 I/O pins allow connection to multiple external signals and peripheral interfaces.
- 1.14 V to 1.26 V supply range sets the required operating voltage.
- 0°C to 85°C (TJ) operating range applies to junction temperature.
- 256-VFBGA, CSPBGA package and 256-CSFBGA (9x9) package designation support surface-mount assembly.
Applications
- Embedded system control logic requiring custom state machines or programmable glue logic.
- Peripheral interfacing and signal routing using the 206 available I/O pins.
- On-chip buffering or small data storage using the 75,776 total RAM bits.
Design & Procurement Notes
Design planning should account for the 1.14 V to 1.26 V supply range and the 0°C to 85°C (TJ) junction temperature limit. The 256-VFBGA, CSPBGA package with 256-CSFBGA (9x9) package designation requires surface-mount assembly and a compatible land pattern. The 206 I/O count, 2,112 logic elements/cells, 264 LABs/CLBs, and 75,776 total RAM bits should be mapped against the required signal count, logic density, and buffer storage before finalizing the programmable design.
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