LCMXO3L-2100C-5BG256I
IC FPGA 206 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA
- 庫存
- 1,367 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3L-2100C-5BG256I 的主要供貨及採購資訊。
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LCMXO3L-2100C-5BG256I 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO3L-2100C-5BG256I is a MachXO3 field-programmable gate array (FPGA) integrated circuit for embedded programmable logic designs. It provides 2112 logic elements or cells, 264 logic array blocks or configurable logic blocks, and 75776 total RAM bits. The device exposes 206 input/output pins and is packaged in a 256-LFBGA case, also identified as 256-CABGA (14x14), for surface-mount assembly. The supply voltage range is 2.375 V to 3.465 V, and the junction temperature operating range is -40°C to 100°C.
Key Features
- MachXO3 FPGA device with 2112 logic elements or cells
- 264 logic array blocks or configurable logic blocks
- 75776 total RAM bits
- 206 input/output pins
- 2.375 V to 3.465 V supply voltage range
- 256-LFBGA package, also identified as 256-CABGA (14x14)
- Surface-mount mounting type
- -40°C to 100°C junction temperature operating range
Applications
- Embedded control logic in general-purpose hardware platforms
- Sensor and peripheral interface bridging
- Protocol conversion and glue logic
- Programmable I/O expansion
Design & Procurement Notes
Design considerations should align the board power rail with the 2.375 V to 3.465 V supply voltage range and verify that the 206 input/output pin count supports the planned interface architecture. The 2112 logic elements or cells, 264 logic array blocks or configurable logic blocks, and 75776 total RAM bits define the available programmable logic and embedded memory scope. The 256-LFBGA package, also identified as 256-CABGA (14x14), requires surface-mount assembly and appropriate footprint preparation. Thermal layout should account for the -40°C to 100°C junction temperature operating range during design validation.
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