LCMXO3L-2100C-5BG256C
IC FPGA 206 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA
- 庫存
- 1,414 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3L-2100C-5BG256C 的主要供貨及採購資訊。
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LCMXO3L-2100C-5BG256C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO3L-2100C-5BG256C is a MachXO3 field programmable gate array intended for embedded logic integration. It provides 2112 logic elements/cells, 264 LABs/CLBs, and 75,776 total RAM bits, supporting control logic, state machines, and data buffering within a single FPGA. The part offers 206 I/O, which can be allocated across interface, control, and board-level signal paths as required by the system design. It is supplied in a 256-LFBGA package/case with a 256-CABGA (14x14) package designation and is intended for surface-mount assembly. The supply voltage range is 2.375V ~ 3.465V, and the operating temperature range is 0°C ~ 85°C (TJ).
Key Features
- MachXO3 FPGA with 2112 logic elements/cells and 264 LABs/CLBs.
- 75,776 total RAM bits available for on-chip data storage and buffering.
- 206 I/O for interface expansion and board-level signal routing.
- 2.375V ~ 3.465V supply voltage range.
- 0°C ~ 85°C (TJ) operating temperature range.
- 256-LFBGA package/case with 256-CABGA (14x14) package designation.
- Surface-mount mounting type.
Applications
- Embedded control logic in general-purpose electronic assemblies.
- Peripheral interface aggregation and signal routing using the available I/O.
- State-machine and data-path implementation supported by logic cells and on-chip RAM bits.
- Board-level glue logic and buffer functions in multi-chip designs.
Design & Procurement Notes
When selecting the LCMXO3L-2100C-5BG256C, compare the design's logic, memory, and I/O requirements against the 2112 logic elements/cells, 264 LABs/CLBs, 75,776 total RAM bits, and 206 I/O. The 2.375V ~ 3.465V supply range should be matched to the board power architecture, while thermal planning should reference the 0°C ~ 85°C (TJ) operating range. PCB layout and assembly should account for the surface-mount 256-LFBGA package/case and the 256-CABGA (14x14) package designation. These package details are useful for footprint planning, land-pattern selection, and placement review, but the final design should still verify pin mapping and interface requirements against the device's available resources.
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