LCMXO3L-1300E-6MG256C
IC FPGA 206 I/O 256CSFBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-VFBGA, CSPBGA
- 庫存
- 1,339 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 256-CSFBGA (9x9) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3L-1300E-6MG256C 的主要供貨及採購資訊。
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LCMXO3L-1300E-6MG256C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO3L-1300E-6MG256C is a MachXO3 field programmable gate array (FPGA) intended for embedded logic and interface tasks. The device provides 206 input/output pins, 160 logic array blocks (LABs) or configurable logic blocks (CLBs), 1,280 logic elements/cells, and 65,536 total RAM bits. It is offered in a 256-VFBGA/CSPBGA package, specifically a 256-CSFBGA (9x9) surface-mount package, and operates from a 1.14 V to 1.26 V supply over a 0°C to 85°C junction temperature range.
Key Features
- MachXO3 FPGA architecture with 160 LABs/CLBs and 1,280 logic elements/cells for custom digital logic.
- 206 I/O pins support multi-signal embedded interfaces and board-level connectivity.
- 65,536 total RAM bits provide on-chip storage for small buffers, lookup tables, or temporary data paths.
- 1.14 V to 1.26 V supply voltage range defines the required power-rail envelope for the device.
- 256-VFBGA/CSPBGA package, 256-CSFBGA (9x9), with surface-mount mounting type.
Applications
- Embedded control logic in systems that need custom state machines, glue logic, or signal routing.
- Sensor and actuator interface aggregation using multiple I/O signals.
- Protocol bridging between serial or parallel interfaces within an FPGA fabric.
- Small-buffer data handling using on-chip RAM for temporary storage or lookup functions.
Design & Procurement Notes
When selecting the LCMXO3L-1300E-6MG256C, confirm that the board power system can deliver the specified 1.14 V to 1.26 V supply and that the layout supports the 256-CSFBGA (9x9) surface-mount footprint. The 0°C to 85°C junction temperature range should be used for thermal planning under expected operating conditions. Designers should also verify that 206 I/O pins and 65,536 total RAM bits meet the planned interface and buffering requirements before committing to the FPGA logic budget of 160 LABs/CLBs and 1,280 logic elements/cells.
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