LCMXO3L-1300C-5BG256C
IC FPGA 206 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA
- 庫存
- 2,961 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3 |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3L-1300C-5BG256C 的主要供貨及採購資訊。
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LCMXO3L-1300C-5BG256C 詳細描述
Product Overview
The LCMXO3L-1300C-5BG256C from Lattice Semiconductor Corporation is a MachXO3 field programmable gate array supplied in a 256-LFBGA package with a 256-CABGA (14x14) supplier device package. It provides 206 I/O, 160 LABs/CLBs, 1280 logic elements/cells, and 65536 total RAM bits. The device is surface mount and operates from a 2.375V ~ 3.465V supply over an operating temperature range of 0°C ~ 85°C (TJ). The supplied lifecycle status is Active.
Key Features
- MachXO3 FPGA architecture with 160 LABs/CLBs and 1280 logic elements/cells.
- Includes 65536 total RAM bits and 206 I/O.
- Surface-mount 256-LFBGA package, identified as 256-CABGA (14x14) by supplier device package.
- Supply voltage range is 2.375V ~ 3.465V.
- Operating temperature range is 0°C ~ 85°C (TJ).
- Listed lifecycle status: Active.
Applications
- Programmable logic implementation in embedded control systems that require custom digital interfacing.
- Glue logic or peripheral expansion where flexible I/O mapping is useful.
- Hardware acceleration for small data-path functions using available logic and RAM bits.
- Prototyping or production FPGA designs in surface-mount board assemblies.
Design & Procurement Notes
Designers selecting the LCMXO3L-1300C-5BG256C should align the 256-LFBGA package, the 256-CABGA (14x14) supplier device package designation, surface-mount assembly process, and 206 I/O budget with the board layout. The 2.375V ~ 3.465V supply range and 0°C ~ 85°C (TJ) operating range should be checked against the system power and thermal conditions. The listed resources of 160 LABs/CLBs, 1280 logic elements/cells, and 65536 total RAM bits can guide sizing of logic and memory needs. The supplied lifecycle status is Active, and the 256-CABGA (14x14) package designation should be verified against the PCB land pattern.
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