LCMXO3D-9400ZC-3SG72C
IC FPGA 58 I/O 72QFN
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 72-VFQFN Exposed Pad
- 庫存
- 1,458 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3D |
| Supplier Device Package | 72-QFN (10x10) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3D-9400ZC-3SG72C 的主要供貨及採購資訊。
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LCMXO3D-9400ZC-3SG72C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO3D-9400ZC-3SG72C is a MachXO3D field programmable gate array (FPGA) integrated circuit for embedded logic design. It provides 9400 logic elements/cells, 1175 LABs/CLBs, and 442368 total RAM bits, along with 58 I/O pins. The part uses a 72-VFQFN exposed pad package, 72-QFN (10x10), and is intended for surface-mount assembly. The specified supply voltage range is 2.375V to 3.465V, and the operating temperature range is 0°C to 85°C at the junction (TJ).
Key Features
- MachXO3D FPGA integrated circuit from Lattice Semiconductor Corporation.
- 9400 logic elements/cells and 1175 LABs/CLBs for programmable digital logic.
- 442368 total RAM bits for on-device storage within the FPGA resources.
- 58 I/O pins for connection to external signals.
- Supply voltage range of 2.375V to 3.465V.
- Operating temperature range of 0°C to 85°C (TJ).
- 72-VFQFN exposed pad package, 72-QFN (10x10), surface mount.
Applications
- Reconfigurable control logic in embedded systems that require custom digital functions.
- Interface bridging between external peripherals and system signals using available I/O resources.
- Sensor aggregation and data-path management where programmable logic and total RAM bits are used.
- User-defined timing, sequencing, or state-machine functions in compact surface-mount designs.
Design & Procurement Notes
Designers selecting the LCMXO3D-9400ZC-3SG72C should compare the available 9400 logic elements/cells, 1175 LABs/CLBs, 442368 total RAM bits, and 58 I/O pins against the target logic, memory, and external signal requirements. The 2.375V to 3.465V supply range and 0°C to 85°C (TJ) operating range should be checked against the board power rails and expected junction temperature conditions. The 72-VFQFN exposed pad, 72-QFN (10x10), surface-mount package requires appropriate PCB footprint, pad layout, and thermal handling considerations. Procurement decisions should be based on matching these package and resource specifications to the design rather than assuming capabilities beyond the device's specified resources.
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