LCMXO3D-9400ZC-2SG72I
IC FPGA 58 I/O 72QFN
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 72-VFQFN Exposed Pad
- 庫存
- 1,383 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3D |
| Supplier Device Package | 72-QFN (10x10) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3D-9400ZC-2SG72I 的主要供貨及採購資訊。
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LCMXO3D-9400ZC-2SG72I 詳細描述
Product Overview
The LCMXO3D-9400ZC-2SG72I from Lattice Semiconductor Corporation is a MachXO3D field programmable gate array (FPGA) intended for embedded logic design. It provides 9,400 logic elements/cells, 1,175 LABs/CLBs, and 442,368 total RAM bits, along with 58 I/O pins. The device operates from a 2.375 V to 3.465 V supply and is specified for junction temperatures from -40°C to 100°C. It uses a 72-VFQFN exposed-pad package with a 72-QFN (10 x 10) footprint for surface-mount assembly.
Key Features
- MachXO3D FPGA architecture with 9,400 logic elements/cells and 1,175 LABs/CLBs.
- 442,368 total RAM bits for FPGA design resources.
- 58 I/O pins for external interface and signal routing.
- 2.375 V to 3.465 V supply voltage range.
- -40°C to 100°C operating junction temperature range.
- 72-VFQFN exposed-pad package, 72-QFN (10 x 10), surface mount.
Applications
- Embedded control logic in compact digital systems.
- I/O expansion and signal routing between processors or peripherals.
- Data buffering and logic-based processing using the total RAM bits.
Design & Procurement Notes
Design planning should account for the 2.375 V to 3.465 V supply range and the 72-VFQFN exposed-pad package with a 72-QFN (10 x 10) footprint, which affects PCB layout and surface-mount assembly. The 58 I/O pins and 442,368 total RAM bits define the external interface count and RAM resource budget for the FPGA logic design. The -40°C to 100°C junction temperature range should be considered in thermal analysis, especially when the exposed pad is incorporated into the PCB layout. Selection should verify power rail compatibility, package dimensions, I/O count, and thermal margin for the target board.
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