LCMXO3D-9400HC-6SG72C
IC FPGA 58 I/O 72QFN
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 72-VFQFN Exposed Pad
- 庫存
- 1,482 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3D |
| Supplier Device Package | 72-QFN (10x10) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3D-9400HC-6SG72C 的主要供貨及採購資訊。
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LCMXO3D-9400HC-6SG72C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO3D-9400HC-6SG72C is a MachXO3D field programmable gate array intended for embedded logic, interfacing, and control functions. It provides 9,400 logic elements or cells, 1,175 LABs/CLBs, and 442,368 total RAM bits within a 72-pin QFN package with an exposed pad. The device includes 58 I/O and operates from a 2.375 V to 3.465 V supply, with a specified junction temperature range of 0°C to 85°C. Surface-mount construction supports compact board layouts where programmable logic, memory resources, and I/O are required.
Key Features
- 9,400 logic elements/cells and 1,175 LABs/CLBs for configurable embedded logic.
- 442,368 total RAM bits available as on-device memory resources.
- 58 I/O in a 72-VFQFN exposed-pad package.
- 2.375 V to 3.465 V supply voltage range.
- 0°C to 85°C operating junction temperature range.
- Surface-mount package: 72-QFN (10x10).
Applications
- Embedded control logic in equipment requiring configurable digital interfaces.
- Signal routing and glue logic replacement between microcontrollers, sensors, and peripherals.
- On-board data buffering or small memory mapping using available RAM bits.
- Interface expansion for systems needing 58 I/O.
Design & Procurement Notes
Designers should verify that the board power delivery maintains the 2.375 V to 3.465 V supply range and that thermal calculations keep the junction within 0°C to 85°C. The 72-QFN (10x10) exposed-pad package requires surface-mount assembly and adequate pad layout for thermal and electrical performance. With 58 I/O, 9,400 logic elements/cells, 1,175 LABs/CLBs, and 442,368 total RAM bits, the part is suited to compact embedded logic functions where programmable logic and local memory resources are needed.
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