LCMXO3D-4300ZC-3SG72C

Product Overview

The Lattice Semiconductor Corporation LCMXO3D-4300ZC-3SG72C is a MachXO3D field programmable gate array intended for embedded logic implementation. It provides 4300 logic elements or cells, 538 LABs or CLBs, and 94208 total RAM bits within a 72-pin QFN package with an exposed pad. The device supports 58 I/O pins and operates from a 2.375 V to 3.465 V supply. It is surface mount and rated for a junction temperature range of 0°C to 85°C. This FPGA can be used where reconfigurable control, data routing, or custom peripheral interfacing is required in a compact footprint.

Key Features

• 4300 logic elements or cells and 538 LABs or CLBs for configurable digital logic.
• 94208 total RAM bits for on-device data storage and buffering.
• 58 I/O pins for external device interfacing and system connectivity.
• 72-QFN (10 x 10) surface-mount package with exposed pad for compact PCB integration.
• 2.375 V to 3.465 V supply range and 0°C to 85°C junction temperature rating.

Applications

• Embedded control systems requiring custom logic sequencing or state machine implementation.
• Sensor and actuator interfacing where multiple digital signals need coordinated handling.
• Protocol bridging or data formatting between microcontroller peripherals and external devices.
• Compact logic acceleration for reconfigurable processing blocks in board-level designs.

Design & Procurement Notes

Designers should verify that the 2.375 V to 3.465 V supply range matches the board power architecture and that the 0°C to 85°C junction temperature envelope is adequate for the expected thermal environment. The 72-QFN (10 x 10) exposed-pad package requires appropriate land pattern, paste stencil, and reflow considerations, especially for thermal dissipation through the exposed pad. The 58 I/O count, 4300 logic elements or cells, and 94208 total RAM bits should be mapped against the planned logic, buffering, and external interface requirements before finalizing the FPGA selection.