LCMXO3D-4300HC-6SG72I
IC FPGA 58 I/O 72QFN
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 72-VFQFN Exposed Pad
- 庫存
- 1,485 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3D |
| Supplier Device Package | 72-QFN (10x10) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3D-4300HC-6SG72I 的主要供貨及採購資訊。
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LCMXO3D-4300HC-6SG72I 詳細描述
Product Overview
The LCMXO3D-4300HC-6SG72I from Lattice Semiconductor Corporation is a MachXO3D field programmable gate array integrated circuit intended for embedded logic and interface control tasks. The device provides 4,300 logic elements, 538 LABs/CLBs, 94,208 total RAM bits, and 58 I/O pins in a 72-VFQFN exposed pad surface mount package. Its supply voltage range is 2.375 V to 3.465 V, and the specified junction temperature operating range is -40°C to 100°C.
Key Features
- 4,300 logic elements and 538 LABs/CLBs provide configurable digital logic capacity for embedded control and signal processing functions.
- 94,208 total RAM bits support on-device data buffering, state storage, and small lookup-table implementations.
- 58 I/O pins allow connection to peripherals, memory devices, sensors, buses, and board-level interfaces.
- 2.375 V to 3.465 V supply voltage range is available for board power design.
- The -40°C to 100°C junction temperature range defines the allowed operating conditions.
- 72-VFQFN exposed pad surface mount package with 10 x 10 mm footprint supports compact PCB layouts.
Applications
- Embedded control subsystems that require configurable glue logic, sequencing, and peripheral interface management.
- Control systems that integrate sensors, actuators, memories, and serial or parallel buses.
- Data acquisition and signal conditioning front ends that need local buffering and custom logic between analog and digital components.
- Communication and interface adaptation functions that map between different bus standards or timing domains.
- Prototyping and product platforms where reconfigurable logic and on-device RAM can supplement discrete controllers and small memory blocks.
Design & Procurement Notes
When selecting this FPGA, verify that the 58 I/O pins and 94,208 RAM bits meet the planned interface and buffering requirements before finalizing the logic design. The 72-VFQFN exposed pad package requires surface mount assembly and thermal pad management, while the 2.375 V to 3.465 V supply range must be matched to the board power architecture. The -40°C to 100°C junction temperature range should be considered with respect to worst-case device heating and PCB copper thermal relief. Designers should also confirm that 4,300 logic elements and 538 LABs/CLBs provide sufficient margin for the intended configuration.
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