LCMXO3D-4300HC-5SG72C
IC FPGA 58 I/O 72QFN
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 72-VFQFN Exposed Pad
- 庫存
- 1,330 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO3D |
| Supplier Device Package | 72-QFN (10x10) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO3D-4300HC-5SG72C 的主要供貨及採購資訊。
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LCMXO3D-4300HC-5SG72C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO3D-4300HC-5SG72C is a MachXO3D field programmable gate array for embedded logic integration in compact board designs as a single FPGA component. It provides 4300 logic elements/cells, 538 LABs/CLBs, and 94208 total RAM bits in a 72-VFQFN Exposed Pad package with a 72-QFN (10x10) footprint. The device offers 58 I/O pins, operates from 2.375V ~ 3.465V, and is intended for surface mount assembly. Its operating junction temperature range is 0°C ~ 85°C (TJ).
Key Features
- 4300 logic elements/cells and 538 LABs/CLBs provide configurable embedded logic capacity
- 94208 total RAM bits support on-chip buffering and data handling
- 58 I/O pins allow connection to sensors, interfaces, and external logic
- 72-VFQFN Exposed Pad and 72-QFN (10x10) package support surface mount layouts
- 2.375V ~ 3.465V supply range and 0°C ~ 85°C (TJ) operating junction temperature range define operating conditions
Applications
- Embedded control logic in equipment
- Interface bridging between processors and peripheral devices
- Programmable glue logic in compact board designs
Design & Procurement Notes
Designers should verify that the board power rail remains within 2.375V ~ 3.465V and that the thermal environment keeps the junction temperature within 0°C ~ 85°C (TJ). The supply range should be checked against the system power architecture before board layout. The 72-VFQFN Exposed Pad package requires attention to soldering, thermal relief, and routing for 58 I/O signals. Logic, RAM, and I/O resources should be mapped in the schematic during FPGA design to avoid exceeding 4300 logic elements/cells, 538 LABs/CLBs, and 94208 total RAM bits.
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