LCMXO2280E-4TN100C
IC FPGA 73 I/O 100TQFP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 100-LQFP
- 庫存
- 1,348 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 100-TQFP (14x14) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
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LCMXO2280E-4TN100C 的主要供貨及採購資訊。
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LCMXO2280E-4TN100C 詳細描述
Product Overview
The LCMXO2280E-4TN100C is a Lattice Semiconductor Corporation MachXO field programmable gate array (FPGA) device intended for embedded logic and interface integration in surface-mount board designs. The 100-LQFP package, designated 100-TQFP (14x14), provides 73 I/O pins and supports a supply voltage range of 1.14 V to 1.26 V. Its architecture includes 2280 logic elements or cells, 285 LABs or CLBs, and 28262 total RAM bits. The device is specified for junction temperature operation from 0°C to 85°C (TJ), making it suitable for embedded systems where programmable logic, I/O expansion, or interface integration is required.
Key Features
- MachXO FPGA device with 2280 logic elements or cells and 285 LABs or CLBs.
- Provides 73 I/O pins in a 100-LQFP package, with 100-TQFP (14x14) package designation.
- Includes 28262 total RAM bits for on-device storage or buffering.
- Operates from a 1.14 V to 1.26 V supply and is specified for a junction temperature range of 0°C to 85°C (TJ).
- Surface-mount device using a 100-LQFP, 100-TQFP (14x14) package.
Applications
- Embedded control logic and state-machine implementation in board-level systems.
- Replacement of multiple discrete logic devices with a single programmable logic component.
- I/O expansion and signal routing between embedded subsystems.
- On-device data buffering or small storage functions enabled by 28262 total RAM bits.
- Compact surface-mount logic integration in 100-LQFP assemblies.
Design & Procurement Notes
When selecting the LCMXO2280E-4TN100C, designers should verify that the board power rail can maintain 1.14 V to 1.26 V under worst-case conditions and that the junction temperature remains within 0°C to 85°C (TJ). The 73 I/O pins and 100-LQFP, 100-TQFP (14x14) package footprint should be compared with the required signal count and PCB layout constraints. Logic resources should be evaluated against the design's estimated use of 2280 logic elements or cells and 285 LABs or CLBs, while the 28262 total RAM bits should be considered for buffering or storage requirements. Because the device is surface mount, assembly and inspection processes should match the 100-TQFP package form.
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