LCMXO2280C-4FTN324C
IC FPGA 271 I/O 324FTBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 324-LBGA
- 庫存
- 1,463 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 324-FTBGA (19x19) |
| Voltage - Supply | 1.71V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2280C-4FTN324C 的主要供貨及採購資訊。
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LCMXO2280C-4FTN324C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO2280C-4FTN324C is a MachXO field programmable gate array (FPGA) IC for embedded logic design. It provides 2280 logic elements or cells, 285 LABs or CLBs, 28262 total RAM bits, and 271 I/O in a 324-FTBGA (19x19) surface mount package. The device operates from a 1.71V to 3.465V supply and is specified for a junction temperature range of 0°C to 85°C.
Key Features
- MachXO FPGA architecture with 2280 logic elements or cells and 285 LABs or CLBs
- 28262 total RAM bits of on-chip memory resources
- 271 I/O for board-level signal routing and custom interface implementation
- 1.71V to 3.465V supply voltage range
- 324-LBGA / 324-FTBGA (19x19) surface mount package
- 0°C to 85°C (TJ) operating temperature range
Applications
- Embedded control logic and custom state machine implementation
- Glue logic replacement and board-level signal sequencing
- I/O expansion and peripheral interfacing in embedded systems
Design & Procurement Notes
For design use, confirm that the board power rail remains within 1.71V to 3.465V and that the expected junction temperature stays within 0°C to 85°C. The 2280 logic elements, 285 LABs or CLBs, 28262 RAM bits, and 271 I/O should be compared against the target logic, memory, and pin-count requirements before layout. Because the part uses a 324-FTBGA (19x19) surface mount package, verify the PCB land pattern and assembly process for this package. Use the exact manufacturer part number LCMXO2280C-4FTN324C when ordering to maintain package and device consistency. Confirm that the selected package meets mechanical and thermal constraints.
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