LCMXO2280E-4BN256I
IC FPGA 211 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA, CSPBGA
- 庫存
- 1,455 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
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LCMXO2280E-4BN256I 的主要供貨及採購資訊。
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LCMXO2280E-4BN256I 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO2280E-4BN256I is a MachXO field-programmable gate array (FPGA) integrated circuit intended for embedded logic design. The device provides 2280 logic elements/cells, 285 LABs/CLBs, and 28262 total RAM bits, with 211 I/O resources. It is supplied in a 256-CABGA (14x14) package, also identified as 256-LFBGA, CSPBGA, and uses surface-mount assembly. The supply voltage range is 1.14 V to 1.26 V, and the operating junction temperature range is -40°C to 100°C.
Key Features
- MachXO FPGA architecture with 2280 logic elements/cells and 285 LABs/CLBs.
- 28262 total RAM bits for on-device data storage and buffering.
- 211 I/O resources for external signal connection and interface mapping.
- 256-CABGA (14x14) surface-mount package, also identified as 256-LFBGA, CSPBGA.
- Supply voltage range of 1.14 V to 1.26 V.
- Operating junction temperature range of -40°C to 100°C.
Applications
- Embedded control logic where custom state machines and timing functions are implemented within a programmable device.
- I/O expansion and signal routing between processors, peripherals, or board-level subsystems.
- Glue logic replacement in designs that require configurable interconnection and custom logic functions.
- Data buffering and on-device storage paths using the 28262 total RAM bits.
- Custom peripheral interfaces where the 211 I/O count supports external connection points.
Design & Procurement Notes
Design considerations should focus on the device's programmable logic resources, I/O count, package geometry, supply voltage, and junction temperature limits. The 211 I/O resources and 28262 total RAM bits define the amount of logic and on-device storage that can be allocated in a board design. The 256-CABGA (14x14) surface-mount package requires a footprint and assembly process compatible with BGA mounting. The 1.14 V to 1.26 V supply range and -40°C to 100°C operating junction temperature range should be reflected in power supply design, thermal analysis, and board layout. Procurement notes should treat the exact part number, manufacturer, and package designation as fixed identifiers when matching the device to a bill of materials.
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