LCMXO2280E-5FTN324C
IC FPGA 271 I/O 324FTBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 324-LBGA
- 庫存
- 1,423 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 324-FTBGA (19x19) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2280E-5FTN324C 的主要供貨及採購資訊。
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LCMXO2280E-5FTN324C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO2280E-5FTN324C is a MachXO field-programmable gate array (FPGA) in a 324-FTBGA (19x19) surface-mount package. The device provides 2280 logic elements/cells, 285 LABs/CLBs, 28262 total RAM bits, and 271 I/O pins. It operates from a 1.14V to 1.26V supply and has a junction temperature range of 0°C to 85°C.
Key Features
- MachXO FPGA architecture with 2280 logic elements/cells and 285 LABs/CLBs for programmable control and data-path logic.
- 28262 total RAM bits are available for on-chip storage.
- 271 I/O pins provide external connectivity in a 324-LBGA / 324-FTBGA (19x19) surface-mount package.
- Supply range of 1.14V to 1.26V and junction temperature range of 0°C to 85°C set the operating limits.
Applications
- Embedded control subsystems that need programmable logic to replace discrete glue logic and manage multiple external signals.
- Peripheral interface bridging between processors or controllers and external devices using the available I/O and on-chip RAM.
- State-machine, sequencing, and timing functions in designs constrained by a 0°C to 85°C junction temperature range.
Design & Procurement Notes
Designers should verify that the 324-FTBGA (19x19) surface-mount package, 271 I/O count, 2280 logic elements/cells, 285 LABs/CLBs, and 28262 total RAM bits meet the required board area, signal count, logic density, and on-chip storage needs. The 1.14V to 1.26V supply range must be matched by the board power architecture, and thermal design should keep the junction temperature within 0°C to 85°C. I/O planning should account for the device's external pin count before finalizing the PCB layout. Use the 324-LBGA and 324-FTBGA (19x19) package designations to confirm footprint requirements.
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