LCMXO2280E-3MN132I
IC FPGA 101 I/O 132CSBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 132-LFBGA, CSPBGA
- 庫存
- 1,304 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 132-CSPBGA (8x8) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2280E-3MN132I 的主要供貨及採購資訊。
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LCMXO2280E-3MN132I 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO2280E-3MN132I is a MachXO FPGA device packaged in a 132-LFBGA, CSPBGA case. It provides 285 LABs/CLBs, 2280 logic elements/cells, 28262 total RAM bits, and 101 I/O pins for embedded logic implementation. The surface-mount device operates from a 1.14 V to 1.26 V supply and supports a junction temperature range of -40°C to 100°C.
Key Features
- MachXO FPGA resources include 285 LABs/CLBs and 2280 logic elements/cells.
- The device provides 28262 total RAM bits.
- It provides 101 I/O pins in a 132-LFBGA, CSPBGA surface-mount package.
- It operates from a 1.14 V to 1.26 V supply across a -40°C to 100°C junction temperature range.
- The device package is 132-CSPBGA (8x8).
Applications
- Implementation of custom digital control logic in embedded systems.
- Bridging between board-level logic functions and external I/O devices.
- Use of available RAM bits for data storage functions in custom logic designs.
Design & Procurement Notes
For board design, the 1.14 V to 1.26 V supply range requires a regulated voltage compatible with the specified operating condition. The 132-LFBGA, CSPBGA surface-mount package, with a 132-CSPBGA (8x8) device package, affects footprint, soldering, and thermal layout. The 101 I/O count should be checked against required board interfaces, while the 285 LABs/CLBs, 2280 logic elements/cells, and 28262 total RAM bits define the available logic and memory resources. The -40°C to 100°C junction temperature range should be considered with system thermal management. These package and supply characteristics should be reviewed during schematic and layout planning. During procurement, confirm package and supply compatibility with the bill of materials.
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