LCMXO2280C-3FTN256C
IC FPGA 211 I/O 256FTBGA
Quick Answer: The Lattice Semiconductor Corporation LCMXO2280C-3FTN256C is a MachXO FPGA provided in a 256-LBGA package, with a supplier device package identified as 256-FTBGA (17x17).
- Manufacturer
- Lattice Semiconductor Corporation
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 256-LBGA
- Stock
- 5,394 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Lattice Semiconductor Corporation |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 256-FTBGA (17x17) |
| Voltage - Supply | 1.71V ~ 3.465V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for LCMXO2280C-3FTN256C.
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Detailed Description for LCMXO2280C-3FTN256C
Product Overview
The Lattice Semiconductor Corporation LCMXO2280C-3FTN256C is a MachXO FPGA provided in a 256-LBGA package, with a supplier device package identified as 256-FTBGA (17x17). The device is surface-mount and includes 211 I/O, 2280 logic elements/cells, 285 LABs/CLBs, and 28262 total RAM bits. Its supply voltage range is 1.71V to 3.465V, and the stated operating temperature range is 0°C to 85°C (TJ). The supplied lifecycle status is Active.
Key Features
- MachXO FPGA with 2280 logic elements/cells and 285 LABs/CLBs.
- 211 I/O for board-level signal connection and logic integration.
- 28262 total RAM bits available for on-device storage.
- 256-LBGA package with 256-FTBGA (17x17) supplier device package.
- Surface-mount mounting type for PCB assembly.
- 1.71V to 3.465V supply voltage range.
- 0°C to 85°C (TJ) operating temperature range.
Applications
- Embedded control logic where available I/O and on-device RAM support custom peripheral interfaces.
- Instrumentation or test equipment functions that use FPGA logic resources for sequencing, processing, or timing-related control.
- Communications hardware that uses FPGA logic and I/O for data routing or buffering within the available resources.
Design & Procurement Notes
When selecting the LCMXO2280C-3FTN256C, verify that the board power supply remains within 1.71V to 3.465V and that the junction temperature stays within 0°C to 85°C (TJ). The 256-LBGA / 256-FTBGA (17x17) surface-mount package requires a compatible PCB land pattern and assembly process. Design margins should be based on the 211 I/O, 2280 logic elements/cells, 285 LABs/CLBs, and 28262 total RAM bits rather than family-level assumptions. The Active lifecycle status is useful for current designs, while the supplied data does not include qualification claims beyond the listed package, temperature, voltage, and mounting information.
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