LCMXO2280C-3BN256I

Product Overview

The Lattice Semiconductor Corporation LCMXO2280C-3BN256I is a MachXO field programmable gate array (FPGA) intended for embedded logic implementation. It provides 2280 logic elements/cells, 285 LABs/CLBs, and 28,262 total RAM bits within a 256-LFBGA, CSPBGA package. The device offers 211 I/O and operates from a 1.71 V to 3.465 V supply. Its surface-mount construction supports compact board layouts, while the operating temperature range of -40°C to 100°C (TJ) supports use within that junction temperature range.

Key Features

• MachXO FPGA device with 2280 logic elements/cells and 285 LABs/CLBs.
• 28,262 total RAM bits for embedded storage and logic implementation.
• 211 I/O for board-level connectivity and interface expansion.
• Supply voltage range of 1.71 V to 3.465 V.
• Operating temperature range of -40°C to 100°C (TJ).
• Surface-mount 256-LFBGA, CSPBGA package; 256-CABGA (14x14) package.

Applications

• Embedded control logic in systems that need custom state-machine behavior.
• Interface bridging between processors, peripherals, and board-level I/O resources.
• Glue logic replacement where multiple discrete functions are consolidated into programmable logic.
• I/O expansion for compact boards using the 211 available I/O.

Design & Procurement Notes

Designers should verify that the board power rail falls within 1.71 V to 3.465 V and that the expected junction temperature remains within -40°C to 100°C (TJ). The 211 I/O and 28,262 total RAM bits should be mapped against the planned logic, buffering, and interface requirements before package selection. The 256-LFBGA, CSPBGA surface-mount package supports compact layouts, while the 256-CABGA (14x14) package should be considered during footprint and assembly planning. Because this is an FPGA, design effort includes logic synthesis, I/O assignment, and timing closure rather than fixed-function IC selection.