LCMXO2-7000ZE-3FTG256I
IC FPGA 206 I/O 256FTBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LBGA
- 庫存
- 1,470 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 256-FTBGA (17x17) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-7000ZE-3FTG256I 的主要供貨及採購資訊。
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LCMXO2-7000ZE-3FTG256I 詳細描述
Product Overview
The LCMXO2-7000ZE-3FTG256I from Lattice Semiconductor Corporation is a MachXO2 field programmable gate array (FPGA) intended for embedded programmable logic designs. It provides 6,864 logic elements/cells, 858 LABs/CLBs, 245,760 total RAM bits, and 206 I/O. The device operates from a 1.14 V to 1.26 V supply, is surface mount, and is specified for junction temperature operation from -40°C to 100°C. The package/case is 256-LBGA, with a 256-FTBGA (17x17) package.
Key Features
- MachXO2 FPGA architecture with 6,864 logic elements/cells
- 858 LABs/CLBs for configurable logic resources
- 245,760 total RAM bits for embedded memory structures
- 206 I/O for external interface connections
- 1.14 V to 1.26 V supply voltage range
- -40°C to 100°C operating junction temperature range
- Surface-mount 256-FTBGA (17x17) package with 256-LBGA package/case designation
Applications
- Programmable control logic in embedded systems
- Interface logic for processor and peripheral connections
- Glue logic replacement in compact surface-mount designs
- Custom state machines and data-path logic in programmable hardware
- Configurable logic for data formatting and signal routing
Design & Procurement Notes
Designers should confirm that the 1.14 V to 1.26 V supply range, 206 I/O count, 245,760 total RAM bits, 6,864 logic elements/cells, and 858 LABs/CLBs meet the logic, memory, and pin requirements of the target board. The -40°C to 100°C junction temperature range should be checked against the expected thermal environment and board power dissipation. The 256-FTBGA (17x17) surface-mount package requires appropriate PCB land patterns, reflow profile, and routing for the available I/O. Because the device is a programmable logic component, final selection should be based on the implemented design's resource utilization, interface timing, and package constraints.
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