料號

LCMXO2-7000ZE-2TG144C

IC FPGA 114 I/O 144TQFP

封裝
144-LQFP
庫存
1,429 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package Tray
Product status Active
Series MachXO2
Supplier Device Package 144-TQFP (20x20)
Voltage - Supply 1.14V ~ 1.26V
資料表 查看資料表PDF
採購資訊

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料號 LCMXO2-7000ZE-2TG144C
供貨狀態 列示庫存 1,429 pcs 當前數量需確認。
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LCMXO2-7000ZE-2TG144C 詳細描述

Product Overview

The Lattice Semiconductor Corporation LCMXO2-7000ZE-2TG144C is a MachXO2 field programmable gate array intended for embedded logic implementation. It provides 6864 logic elements or cells, 858 LABs or CLBs, 245760 total RAM bits, and 114 input/output pins. The device is housed in a 144-LQFP package, with a 144-TQFP (20x20) package designation, and is mounted by surface mount technology. Its specified supply voltage range is 1.14V to 1.26V, and its operating temperature range is 0°C to 85°C at the junction.

Key Features

  • MachXO2 FPGA architecture with 6864 logic elements or cells and 858 LABs or CLBs.
  • 245760 total RAM bits support on-chip data storage for embedded logic functions.
  • 114 I/O pins provide extensive interface connectivity for board-level digital systems.
  • 144-LQFP package with 144-TQFP (20x20) package designation for surface mount assembly.
  • Supply voltage range of 1.14V to 1.26V and junction temperature range of 0°C to 85°C.

Applications

  • Reconfigurable control logic in embedded systems where digital functions can be updated without changing the board wiring.
  • Protocol bridging between digital interfaces using the available I/O and programmable logic resources.
  • Glue logic replacement for discrete digital components in equipment control boards.
  • Sensor and actuator interface logic where on-chip RAM supports temporary data buffering.
  • Display or data-path control logic using programmable timing and state functions.

Design & Procurement Notes

Designers should confirm that the power supply remains within the specified 1.14V to 1.26V range and that the junction temperature does not exceed 85°C under expected operating conditions. The 144-TQFP (20x20) package requires a surface mount footprint compatible with the 144-LQFP package and adequate pad access for 114 I/O pins. The available logic cells, LABs or CLBs, and total RAM bits should be compared with the planned design resource budget before layout. Procurement specifications should retain the exact manufacturer part number and package designation to avoid ambiguity.

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