LCMXO2-7000ZE-2BG332C
IC FPGA 278 I/O 332CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 332-FBGA
- 庫存
- 1,443 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 332-CABGA (17x17) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-7000ZE-2BG332C 的主要供貨及採購資訊。
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LCMXO2-7000ZE-2BG332C 詳細描述
Product Overview
The LCMXO2-7000ZE-2BG332C is a Lattice Semiconductor Corporation MachXO2 field programmable gate array (FPGA) supplied in a 332-CABGA (17x17) surface mount package. The device provides 278 I/O, 6864 logic elements or cells, 858 LABs or CLBs, and 245760 total RAM bits. Its specified supply voltage is 1.14V ~ 1.26V, and its operating temperature range is 0°C ~ 85°C (TJ).
Key Features
- MachXO2 FPGA with 6864 logic elements or cells and 858 LABs or CLBs.
- Integrates 245760 total RAM bits for on-device data storage.
- Provides 278 I/O in a 332-CABGA (17x17) surface mount package.
- Operates from a 1.14V ~ 1.26V supply within a 0°C ~ 85°C (TJ) temperature range.
Applications
- Embedded control logic where available I/O and on-device RAM support system-level coordination.
- Sensor and peripheral interface aggregation in board-level designs.
- Data path routing and programmable logic implementation using available I/O.
Design & Procurement Notes
Design teams should compare the 6864 logic elements or cells, 858 LABs or CLBs, 245760 total RAM bits, and 278 I/O against the required device resource budget. The 1.14V ~ 1.26V supply range should guide regulator selection and decoupling network design. Because the package is a 332-CABGA (17x17) surface mount component, PCB layout should reserve sufficient area and pin access for the I/O count. Thermal design should keep the junction temperature within the specified 0°C ~ 85°C (TJ) range under expected board conditions. Assembly processes should match the surface mount package. The 332-FBGA package designation should be matched to the footprint and assembly documentation.
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