LCMXO2-7000HE-6BG332C

Product Overview

The LCMXO2-7000HE-6BG332C is a Lattice Semiconductor Corporation MachXO2 FPGA in a 332-FBGA package, also identified as 332-CABGA (17x17), with surface-mount orientation. The device provides 278 I/O pins, 6,864 logic elements, 858 LABs/CLBs, and 245,760 total RAM bits. It operates from a 1.14 V to 1.26 V supply and is specified for junction temperatures from 0°C to 85°C.

Key Features

• 278 I/O pins are provided for external device connections.
• 6,864 logic elements and 858 LABs/CLBs are included in the FPGA logic resources.
• 245,760 total RAM bits are included in the device.
• The specified supply range is 1.14 V to 1.26 V.
• The 332-FBGA package and 332-CABGA (17x17) package are surface-mount.
• The junction temperature operating range is 0°C to 85°C.

Applications

• I/O expansion and glue logic in embedded control boards
• Protocol bridging and interface translation in measurement and control hardware
• Data buffering and preprocessing in sensor aggregation systems
• Custom logic implementation in general-purpose embedded processing platforms

Design & Procurement Notes

Design considerations include allocating PCB area for the 332-FBGA package and 332-CABGA (17x17) surface-mount footprint, routing up to 278 I/O signals, and providing a supply that remains within 1.14 V to 1.26 V. The 0°C to 85°C junction temperature limit should be used with thermal analysis under board power dissipation. Logic and memory planning should be based on the 6,864 logic elements, 858 LABs/CLBs, and 245,760 RAM bits. Confirm that the selected connector count, pin map, and land pattern are compatible with the package and I/O count before finalizing the board layout.