LCMXO2-7000HE-5FTG256C
IC FPGA 206 I/O 256FTBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LBGA
- 庫存
- 1,324 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 256-FTBGA (17x17) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-7000HE-5FTG256C 的主要供貨及採購資訊。
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LCMXO2-7000HE-5FTG256C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO2-7000HE-5FTG256C is a MachXO2 field programmable gate array in a 256-LBGA package, with a 256-FTBGA (17x17) device package. It provides 206 I/O pins, 858 LABs/CLBs, 6864 logic elements/cells, and 245760 total RAM bits for custom digital logic and embedded system integration. The device is surface mount and operates over a junction temperature range of 0°C to 85°C, with a supply voltage range of 1.14V to 1.26V. This FPGA is intended for designs that require programmable logic resources and multiple I/O interfaces within a compact BGA form factor.
Key Features
- MachXO2 FPGA architecture with 858 LABs/CLBs and 6864 logic elements/cells.
- 245760 total RAM bits for on-device data storage and buffering.
- 206 I/O pins for external digital interfacing.
- Supply voltage range of 1.14V to 1.26V.
- Operating temperature range of 0°C to 85°C (TJ).
- Surface-mount 256-LBGA package, 256-FTBGA (17x17) device package.
Applications
- Embedded control systems requiring custom digital logic and I/O expansion.
- Protocol bridging between different digital interfaces.
- Data path processing and buffering using on-device RAM.
- Programmable glue logic and digital interconnection.
Design & Procurement Notes
Designers should confirm the 256-LBGA / 256-FTBGA (17x17) footprint and surface-mount assembly process before layout. The 1.14V to 1.26V supply range should be matched by the board power architecture, and the 0°C to 85°C (TJ) operating range should be considered in thermal design. The available 206 I/O pins, 858 LABs/CLBs, 6864 logic elements/cells, and 245760 RAM bits should be compared against the planned logic, buffering, and interface requirements to verify that the device capacity is sufficient.
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