LCMXO2-7000HE-5BG332C
IC FPGA 278 I/O 332CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 332-FBGA
- 庫存
- 1,291 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 332-CABGA (17x17) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-7000HE-5BG332C 的主要供貨及採購資訊。
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LCMXO2-7000HE-5BG332C 詳細描述
Product Overview
The LCMXO2-7000HE-5BG332C is a Lattice Semiconductor Corporation MachXO2 field programmable gate array (FPGA) for embedded logic and reconfigurable I/O tasks. It provides 6,864 logic elements or cells, 858 LABs/CLBs, and 245,760 total RAM bits, giving a defined amount of programmable logic and on-chip memory for control, data path, and interface functions. The device includes 278 I/O pins in a 332-CABGA (17x17) surface-mount package. The supply voltage range is 1.14 V to 1.26 V, and the junction temperature operating range is 0°C to 85°C.
Key Features
- 6,864 logic elements or cells for programmable digital logic
- 858 LABs/CLBs as the logic block count
- 245,760 total RAM bits for on-chip memory resources
- 278 I/O pins for external signal connection
- 332-CABGA (17x17) surface-mount package
- 1.14 V to 1.26 V supply voltage range
- 0°C to 85°C (TJ) operating temperature range
Applications
- Programmable glue logic and control sequencing in embedded systems
- I/O expansion and signal routing between processors, sensors, and peripherals
- Data formatting, buffering, and protocol adaptation using logic and RAM resources
- Sensor data aggregation and digital conditioning logic in measurement subsystems
- Custom interface bridging in communication and data acquisition hardware
Design & Procurement Notes
Design teams should size logic, memory, and I/O usage against the 6,864 logic element, 858 LAB/CLB, 245,760 RAM bit, and 278 I/O pin resources. The 1.14 V to 1.26 V supply range requires a power architecture that maintains voltage within that window. The 0°C to 85°C junction temperature range should be considered in thermal planning. The 332-CABGA (17x17) package designation should be reflected consistently in PCB footprints and assembly documentation.
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