料號

LCMXO2-7000HE-5BG332C

IC FPGA 278 I/O 332CABGA

封裝
332-FBGA
庫存
1,291 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package Tray
Product status Active
Series MachXO2
Supplier Device Package 332-CABGA (17x17)
Voltage - Supply 1.14V ~ 1.26V
資料表 查看資料表PDF
採購資訊

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LCMXO2-7000HE-5BG332C 的主要供貨及採購資訊。

查詢價格及供貨
料號 LCMXO2-7000HE-5BG332C
供貨狀態 列示庫存 1,291 pcs 當前數量需確認。
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LCMXO2-7000HE-5BG332C 詳細描述

Product Overview

The LCMXO2-7000HE-5BG332C is a Lattice Semiconductor Corporation MachXO2 field programmable gate array (FPGA) for embedded logic and reconfigurable I/O tasks. It provides 6,864 logic elements or cells, 858 LABs/CLBs, and 245,760 total RAM bits, giving a defined amount of programmable logic and on-chip memory for control, data path, and interface functions. The device includes 278 I/O pins in a 332-CABGA (17x17) surface-mount package. The supply voltage range is 1.14 V to 1.26 V, and the junction temperature operating range is 0°C to 85°C.

Key Features

  • 6,864 logic elements or cells for programmable digital logic
  • 858 LABs/CLBs as the logic block count
  • 245,760 total RAM bits for on-chip memory resources
  • 278 I/O pins for external signal connection
  • 332-CABGA (17x17) surface-mount package
  • 1.14 V to 1.26 V supply voltage range
  • 0°C to 85°C (TJ) operating temperature range

Applications

  • Programmable glue logic and control sequencing in embedded systems
  • I/O expansion and signal routing between processors, sensors, and peripherals
  • Data formatting, buffering, and protocol adaptation using logic and RAM resources
  • Sensor data aggregation and digital conditioning logic in measurement subsystems
  • Custom interface bridging in communication and data acquisition hardware

Design & Procurement Notes

Design teams should size logic, memory, and I/O usage against the 6,864 logic element, 858 LAB/CLB, 245,760 RAM bit, and 278 I/O pin resources. The 1.14 V to 1.26 V supply range requires a power architecture that maintains voltage within that window. The 0°C to 85°C junction temperature range should be considered in thermal planning. The 332-CABGA (17x17) package designation should be reflected consistently in PCB footprints and assembly documentation.

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