LCMXO2-7000HE-4TG144C
IC FPGA 114 I/O 144TQFP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 144-LQFP
- 庫存
- 1,809 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 144-TQFP (20x20) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-7000HE-4TG144C 的主要供貨及採購資訊。
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LCMXO2-7000HE-4TG144C 詳細描述
Product Overview
The LCMXO2-7000HE-4TG144C is a Lattice Semiconductor Corporation MachXO2 field programmable gate array (FPGA) integrated circuit. It is supplied in a 144-LQFP package, with the supplier device package listed as 144-TQFP (20x20), and uses surface-mount mounting. The device provides 114 I/O pins and contains 6864 logic elements/cells, 858 LABs/CLBs, and 245760 total RAM bits. The specified supply voltage range is 1.14V to 1.26V, and the operating temperature range is 0°C to 85°C (TJ).
Key Features
- MachXO2 FPGA architecture with 6864 logic elements/cells and 858 LABs/CLBs
- 245760 total RAM bits available for on-chip data storage or buffering
- 114 I/O pins for external signal interfacing
- 144-LQFP surface-mount package, supplier device package 144-TQFP (20x20)
- 1.14V to 1.26V supply voltage range
- 0°C to 85°C junction temperature operating range
Applications
- Embedded control logic where configurable digital functions replace fixed-function glue logic
- Peripheral interfacing and protocol bridging using the available 114 I/O pins
- Data buffering or temporary storage tasks supported by 245760 total RAM bits
- Timing, sequencing, and state-machine implementations within the specified 0°C to 85°C junction temperature range
- Prototype hardware designs that require a surface-mount FPGA in a 144-TQFP (20x20) package
Design & Procurement Notes
When selecting this Lattice Semiconductor Corporation device, confirm that the board power architecture can maintain the 1.14V to 1.26V supply range and that the PCB layout supports the 144-TQFP (20x20) surface-mount package. Designers should size the logic, I/O, and RAM resources against the supplied values of 6864 logic elements/cells, 858 LABs/CLBs, 114 I/O pins, and 245760 total RAM bits. Thermal planning should account for the 0°C to 85°C junction temperature limit. The Active product status can be considered during procurement planning, while
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