LCMXO2-7000HE-4BG332C
IC FPGA 278 I/O 332CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 332-FBGA
- 庫存
- 1,315 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 332-CABGA (17x17) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-7000HE-4BG332C 的主要供貨及採購資訊。
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LCMXO2-7000HE-4BG332C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO2-7000HE-4BG332C is a MachXO2 FPGA in a 332-CABGA (17x17) surface-mount package. It provides 278 I/O pins, 6864 logic elements or cells, and 858 LABs/CLBs for implementing custom digital functions. The device also includes 245760 total RAM bits, supporting data storage and buffering structures. Its supply voltage range is 1.14 V to 1.26 V, and its operating temperature range is 0°C to 85°C (TJ). The 332-FBGA package and embedded FPGA function support compact board designs that need custom digital logic resources.
Key Features
- MachXO2 FPGA device with 6864 logic elements or cells and 858 LABs/CLBs.
- 278 I/O pins for board-level digital interface and control connections.
- 245760 total RAM bits available for data storage and buffering.
- 332-CABGA (17x17) surface-mount package with 332-FBGA case designation.
- Supply voltage range of 1.14 V to 1.26 V and operating temperature range of 0°C to 85°C (TJ).
Applications
- Embedded control logic implementing custom digital functions.
- Board-level data buffering and digital interface connections.
- Compact surface-mount designs using the 278 I/O pins for custom digital interfacing.
Design & Procurement Notes
Design considerations include matching the 1.14 V to 1.26 V supply range and maintaining junction temperature within 0°C to 85°C (TJ). The 332-CABGA (17x17) surface-mount package requires a PCB footprint and assembly process compatible with surface-mount components. The 278 I/O count and 245760 total RAM bits support logic-intensive and storage-intensive functions, but system designers should verify that the selected logic density, I/O assignment, and package layout fit the board design. Because the device uses surface-mount packaging, mechanical mounting, thermal management, and signal integrity planning should be based on the 332-FBGA package geometry and the 0°C to 85°C (TJ) operating range.
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