LCMXO2-7000HC-6BG256C
IC FPGA 206 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA
- 庫存
- 1,371 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-7000HC-6BG256C 的主要供貨及採購資訊。
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LCMXO2-7000HC-6BG256C 詳細描述
Product Overview
The LCMXO2-7000HC-6BG256C is a MachXO2 field programmable gate array from Lattice Semiconductor Corporation. It provides 6864 logic elements or cells, 858 LABs or CLBs, 245760 total RAM bits, and 206 I/O connections in a surface mount 256-LFBGA package, 256-CABGA (14x14). The device operates from a 2.375V to 3.465V supply and has a junction temperature range of 0°C to 85°C (TJ), supporting programmable digital logic and embedded system integration.
Key Features
- MachXO2 FPGA architecture with 6864 logic elements or cells and 858 LABs or CLBs.
- 245760 total RAM bits for on-chip data storage and buffering.
- 206 I/O connections for board-level signal routing and interface expansion.
- Surface mount 256-LFBGA package, 256-CABGA (14x14).
- 2.375V to 3.465V supply voltage and 0°C to 85°C (TJ) operating temperature.
Applications
- Embedded control systems requiring custom programmable logic.
- Board-level I/O expansion and signal routing.
- On-chip memory buffering within digital data paths.
- Programmable logic replacement in existing hardware designs.
Design & Procurement Notes
Design planning should account for the 206 I/O count, 245760 total RAM bits, and 6864 logic elements when allocating logic resources and mapping signals. The surface mount 256-LFBGA package, 256-CABGA (14x14), affects PCB layout, pad geometry, and thermal management. The 2.375V to 3.465V supply range and 0°C to 85°C (TJ) junction temperature range should be matched to board power rails and expected operating conditions. Procurement and integration planning should confirm package compatibility, power supply fit, and I/O requirements for the target system.
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