LCMXO2-7000HC-4FTG256C
IC FPGA 206 I/O 256FTBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LBGA
- 庫存
- 1,377 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 256-FTBGA (17x17) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-7000HC-4FTG256C 的主要供貨及採購資訊。
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LCMXO2-7000HC-4FTG256C 詳細描述
Product Overview
The LCMXO2-7000HC-4FTG256C from Lattice Semiconductor Corporation is a MachXO2 field programmable gate array intended for embedded logic and I/O expansion. The device provides 6,864 logic elements or cells across 858 LABs/CLBs, along with 245,760 total RAM bits and 206 I/O pins. It is a surface-mount device in a 256-LBGA package, with the device package designation 256-FTBGA (17x17). The specified supply voltage range is 2.375V to 3.465V, and the junction temperature operating range is 0°C to 85°C. These characteristics support programmable glue logic, interface adaptation, and compact embedded control subsystems where reconfigurable resources are needed.
Key Features
- MachXO2 FPGA architecture with 6,864 logic elements/cells and 858 LABs/CLBs.
- 245,760 total RAM bits for on-chip memory resources.
- 206 I/O pins for connection to external logic and peripheral devices.
- Supply voltage range of 2.375V to 3.465V.
- Surface-mount 256-LBGA package; 256-FTBGA (17x17) device package.
- Operating temperature range of 0°C to 85°C (TJ).
Applications
- Programmable glue logic and interface adaptation in embedded systems.
- Reconfigurable control logic for equipment subsystems.
- Buffering and logic interfacing between processors, memory, and peripheral devices.
Design & Procurement Notes
Design teams should verify that the 2.375V to 3.465V supply range matches the board power architecture and that 206 I/O pins provide sufficient connectivity for the intended logic functions. The 6,864 logic elements/cells, 858 LABs/CLBs, and 245,760 total RAM bits should be mapped against resource requirements before layout. Because the device is surface mount in a 256-LBGA package, with a 256-FTBGA (17x17) device package, PCB land pattern, stencil, and inspection method should be selected for surface-mount assembly. The 0°C to 85°C (TJ) operating range requires thermal analysis under expected board conditions.
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