LCMXO2-7000HC-4BG332I
IC FPGA 278 I/O 332CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 332-FBGA
- 庫存
- 1,468 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 332-CABGA (17x17) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-7000HC-4BG332I 的主要供貨及採購資訊。
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LCMXO2-7000HC-4BG332I 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO2-7000HC-4BG332I is a MachXO2 field programmable gate array (FPGA) for embedded programmable logic designs. It provides 6,864 logic elements, 858 LABs/CLBs, and 245,760 total RAM bits in a 332-CABGA (17 x 17) surface-mount package. The device exposes 278 I/O pins for connection to digital interfaces and control signals. Its supply voltage range is 2.375 V to 3.465 V, and its operating junction temperature range is -40°C to 100°C. These characteristics define a programmable logic device with configurable resources and a 278 I/O count.
Key Features
- MachXO2 FPGA architecture with 6,864 logic elements and 858 LABs/CLBs.
- 245,760 total RAM bits for on-chip storage and data buffering.
- 278 I/O pins in a 332-CABGA (17 x 17) surface-mount package.
- Supply voltage range of 2.375 V to 3.465 V.
- Operating junction temperature range of -40°C to 100°C.
Applications
- Embedded control logic where user-programmable state machines and glue logic are required.
- Digital sensor aggregation and preprocessing using available logic elements and on-chip RAM bits.
- Interface expansion between a host system and digital peripherals using 278 I/O pins.
Design & Procurement Notes
When selecting this FPGA, plan the power distribution network for the specified 2.375 V to 3.465 V supply range and verify that the board voltage regulator can maintain that range under load. Review the thermal budget using the -40°C to 100°C junction temperature limit, especially for designs with high I/O activity or dense routing. The 332-CABGA (17 x 17) package requires a compatible surface-mount land pattern and assembly process. Resource allocation should account for 6,864 logic elements, 858 LABs/CLBs, 245,760 total RAM bits, and 278 I/O pins when defining logic, memory, and pin assignments.
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