料號

LCMXO2-640HC-4TG100I

IC FPGA 78 I/O 100TQFP

封裝
100-LQFP
庫存
2,450 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package Tray
Product status Active
Series MachXO2
Supplier Device Package 100-TQFP (14x14)
Voltage - Supply 2.375V ~ 3.465V
資料表 查看資料表PDF
採購資訊

採購概覽

LCMXO2-640HC-4TG100I 的主要供貨及採購資訊。

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料號 LCMXO2-640HC-4TG100I
供貨狀態 列示庫存 2,450 pcs 當前數量需確認。
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LCMXO2-640HC-4TG100I 詳細描述

Product Overview

LCMXO2-640HC-4TG100I is a Lattice Semiconductor Corporation MachXO2 field-programmable gate array for surface-mount designs. The device provides 640 logic elements or cells, 80 LABs or CLBs, 18,432 total RAM bits, and 78 input/output pins. It uses a 100-LQFP package, with a 100-TQFP (14 mm by 14 mm) body, and operates from a 2.375 V to 3.465 V supply. The junction temperature range is -40°C to 100°C.

Key Features

  • 640 logic elements or cells and 80 LABs or CLBs provide configurable digital logic resources.
  • 18,432 total RAM bits provide on-chip storage resources.
  • 78 I/O pins are available for user-defined interfacing in a 100-LQFP surface-mount package.
  • The supply voltage range is 2.375 V to 3.465 V.
  • The operating junction temperature range is -40°C to 100°C.

Applications

  • Custom control and sequencing logic in digital systems where flexible I/O mapping is required.
  • Peripheral interfacing and glue-logic replacement using the available logic cells and on-chip RAM.
  • Compact surface-mount FPGA implementations constrained by a 100-LQFP footprint and supply range.

Design & Procurement Notes

Designers should map required functions against the 640 logic elements or cells, 80 LABs or CLBs, 18,432 total RAM bits, and 78 I/O pins before committing to the package. The 100-LQFP or 100-TQFP (14 mm by 14 mm) footprint supports surface-mount assembly, while the 2.375 V to 3.465 V supply range and -40°C to 100°C junction temperature range should be reflected in power sequencing, thermal design, and board-level I/O planning. Because the device is a MachXO2 FPGA, configuration and resource utilization should be reviewed against the available logic and RAM capacity.

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