LCMXO2-640HC-4TG100I
IC FPGA 78 I/O 100TQFP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 100-LQFP
- 庫存
- 2,450 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 100-TQFP (14x14) |
| Voltage - Supply | 2.375V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-640HC-4TG100I 的主要供貨及採購資訊。
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LCMXO2-640HC-4TG100I 詳細描述
Product Overview
LCMXO2-640HC-4TG100I is a Lattice Semiconductor Corporation MachXO2 field-programmable gate array for surface-mount designs. The device provides 640 logic elements or cells, 80 LABs or CLBs, 18,432 total RAM bits, and 78 input/output pins. It uses a 100-LQFP package, with a 100-TQFP (14 mm by 14 mm) body, and operates from a 2.375 V to 3.465 V supply. The junction temperature range is -40°C to 100°C.
Key Features
- 640 logic elements or cells and 80 LABs or CLBs provide configurable digital logic resources.
- 18,432 total RAM bits provide on-chip storage resources.
- 78 I/O pins are available for user-defined interfacing in a 100-LQFP surface-mount package.
- The supply voltage range is 2.375 V to 3.465 V.
- The operating junction temperature range is -40°C to 100°C.
Applications
- Custom control and sequencing logic in digital systems where flexible I/O mapping is required.
- Peripheral interfacing and glue-logic replacement using the available logic cells and on-chip RAM.
- Compact surface-mount FPGA implementations constrained by a 100-LQFP footprint and supply range.
Design & Procurement Notes
Designers should map required functions against the 640 logic elements or cells, 80 LABs or CLBs, 18,432 total RAM bits, and 78 I/O pins before committing to the package. The 100-LQFP or 100-TQFP (14 mm by 14 mm) footprint supports surface-mount assembly, while the 2.375 V to 3.465 V supply range and -40°C to 100°C junction temperature range should be reflected in power sequencing, thermal design, and board-level I/O planning. Because the device is a MachXO2 FPGA, configuration and resource utilization should be reviewed against the available logic and RAM capacity.
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