LCMXO2-4000ZE-2BG256I
IC FPGA 206 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA
- 庫存
- 1,350 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-4000ZE-2BG256I 的主要供貨及採購資訊。
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LCMXO2-4000ZE-2BG256I 詳細描述
Product Overview
The LCMXO2-4000ZE-2BG256I is a Lattice Semiconductor Corporation MachXO2 field programmable gate array (FPGA) for embedded logic designs. It provides 4,320 logic elements or cells, 540 LABs or CLBs, and 94,208 total RAM bits. The device offers 206 I/O and operates from a 1.14V to 1.26V supply. It uses a 256-CABGA (14x14) surface-mount package and supports an operating junction temperature range of -40°C to 100°C.
Key Features
- MachXO2 FPGA architecture with 4,320 logic elements/cells and 540 LABs/CLBs.
- 206 I/O for external device connections and board-level interfacing.
- 94,208 total RAM bits for on-chip data storage or buffering functions.
- Supply voltage range of 1.14V to 1.26V.
- Operating temperature range of -40°C to 100°C (TJ).
- Surface-mount 256-LFBGA package; 256-CABGA (14x14) package form.
Applications
- Embedded control logic where programmable gate-array resources implement custom control, sequencing, or glue logic.
- Interface bridging between external components using the 206 I/O and FPGA logic.
- On-chip data staging or buffering supported by the 94,208 total RAM bits.
- Surface-mount FPGA placement in embedded boards using the 256-CABGA (14x14) package.
Design & Procurement Notes
Designers should confirm that the 1.14V to 1.26V supply range matches the board power architecture and that the 256-CABGA (14x14) footprint is compatible with the PCB layout. The 206 I/O count, 4,320 logic cells, 540 LABs/CLBs, and 94,208 RAM bits define the usable logic and on-chip storage resources for the target design. The -40°C to 100°C junction temperature range should be considered during thermal analysis, especially in dense surface-mount assemblies where board thermal conditions affect junction temperature.
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