LCMXO2-4000ZE-1UWG81ITR
IC FPGA 36WLCSP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 36-UFBGA, WLCSP
- 庫存
- 1,309 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tape & Reel (TR) |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 36-WLCSP (2.54x2.59) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-4000ZE-1UWG81ITR 的主要供貨及採購資訊。
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LCMXO2-4000ZE-1UWG81ITR 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO2-4000ZE-1UWG81ITR is a MachXO2 field-programmable gate array (FPGA) in a 36-UFBGA, WLCSP surface-mount package. It is intended for embedded programmable logic functions, with 4320 logic elements/cells, 540 LABs/CLBs, and 94208 total RAM bits. The device operates from a 1.14 V to 1.26 V supply and has a junction temperature range of -40°C to 100°C. The 36-WLCSP (2.54x2.59) package supports compact board layouts where a small FPGA footprint is required.
Key Features
- MachXO2 FPGA architecture with 4320 logic elements/cells and 540 LABs/CLBs.
- Includes 94208 total RAM bits for on-chip buffering or small data structures.
- Operates from a 1.14 V to 1.26 V supply.
- Rated for junction temperature operation from -40°C to 100°C.
- Uses a 36-UFBGA, WLCSP surface-mount package.
- Package designation includes 36-WLCSP (2.54x2.59).
Applications
- Embedded control logic where configurable state machines, sequencing, or glue logic replace multiple discrete components.
- Sensor data preprocessing for aggregating, filtering, or timing external sensor signals before a host processor handles higher-level processing.
- Protocol bridging between simple digital logic interfaces in embedded systems.
- Compact board designs requiring a small FPGA footprint in space-constrained embedded equipment.
Design & Procurement Notes
Design teams should confirm that the 1.14 V to 1.26 V supply, 36-WLCSP (2.54x2.59) footprint, and surface-mount assembly process fit the target board. The -40°C to 100°C (TJ) operating range should be evaluated against actual junction temperature rise from logic activity and package thermal conditions. The 4320 logic elements/cells, 540 LABs/CLBs, and 94208 total RAM bits provide the resources available for the FPGA fabric, so logic utilization, memory partitioning, and timing closure should be checked during design planning. Because the package is a small WLCSP, routing, soldering, inspection, and thermal relief should be reviewed early.
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