LCMXO2-4000ZE-1FTG256C
IC FPGA 206 I/O 256FTBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LBGA
- 庫存
- 1,460 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 256-FTBGA (17x17) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-4000ZE-1FTG256C 的主要供貨及採購資訊。
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LCMXO2-4000ZE-1FTG256C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO2-4000ZE-1FTG256C is a MachXO2 field programmable gate array for embedded logic functions. It provides 4320 logic elements/cells, 540 LABs/CLBs, 94208 total RAM bits, and 206 I/O in a surface-mount 256-LBGA package. The device operates from a 1.14V ~ 1.26V supply range and has a junction temperature range of 0°C ~ 85°C. The 256-FTBGA (17x17) package form supports compact board layouts where the FPGA logic resources, I/O availability, and on-chip RAM capacity are used for configurable logic integration. Designs that require a programmable logic array within the supply and junction temperature ranges can use this surface-mount package.
Key Features
- MachXO2 FPGA device from Lattice Semiconductor Corporation.
- 4320 logic elements/cells and 540 LABs/CLBs.
- 94208 total RAM bits.
- 206 I/O.
- 1.14V ~ 1.26V supply voltage range.
- 0°C ~ 85°C (TJ) operating temperature range.
- Surface-mount 256-LBGA package; 256-FTBGA (17x17) package form.
Applications
- Embedded control logic in systems that require configurable state machines and glue logic.
- Data buffering within embedded designs using on-chip RAM resources.
- I/O routing in systems that require 206 I/O.
Design & Procurement Notes
Design teams should account for the 1.14V ~ 1.26V supply range and the 0°C ~ 85°C (TJ) operating range when planning power delivery and thermal dissipation. The 4320 logic elements/cells, 540 LABs/CLBs, 94208 total RAM bits, and 206 I/O should be mapped against the target logic, buffering, and external connection requirements before finalizing the board. The surface-mount 256-LBGA package and 256-FTBGA (17x17) package form require footprint, via, and routing planning compatible with the device package.
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