LCMXO2-4000ZE-1BG256C
IC FPGA 206 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA
- 庫存
- 1,455 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-4000ZE-1BG256C 的主要供貨及採購資訊。
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LCMXO2-4000ZE-1BG256C 詳細描述
Product Overview
The LCMXO2-4000ZE-1BG256C is a MachXO2 field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It is a surface-mount integrated circuit in a 256-LFBGA package, with a 256-CABGA (14x14) device package designation. The device provides 206 I/O pins, 4,320 logic elements/cells, 540 LABs/CLBs, and 94,208 total RAM bits. Its specified supply voltage range is 1.14 V to 1.26 V, and its operating temperature range is 0°C to 85°C at the junction (TJ). This FPGA can be used in embedded digital designs that require configurable logic, I/O expansion, and on-chip memory resources.
Key Features
- 4,320 logic elements/cells and 540 LABs/CLBs for configurable digital logic.
- 206 I/O pins for embedded interfacing.
- 94,208 total RAM bits for on-chip data storage.
- 1.14 V to 1.26 V supply voltage range.
- 0°C to 85°C operating temperature range at the junction (TJ).
- Surface-mount 256-LFBGA package with 256-CABGA (14x14) device package designation.
Applications
- Embedded control logic in systems that require programmable gate-level functionality.
- Interface adaptation between a processor or peripheral and external circuitry using the 206 I/O pins.
- On-chip data storage using 94,208 total RAM bits.
- Compact board-level digital subsystem implementation in surface-mount embedded assemblies.
Design & Procurement Notes
When selecting the LCMXO2-4000ZE-1BG256C, verify that the PCB footprint, land pattern, and stencil design match the 256-LFBGA / 256-CABGA (14x14) surface-mount package. Confirm that the system power supply can maintain the specified 1.14 V to 1.26 V supply voltage across operating conditions, and ensure thermal management keeps the junction temperature within 0°C to 85°C. Evaluate the design against the available 4,320 logic elements/cells, 540 LABs/CLBs, 94,208 total RAM bits, and 206 I/O pins to confirm sufficient resources for the intended embedded logic, interfacing, and on-chip memory usage.
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