LCMXO2-4000HE-6MG132I
IC FPGA 104 I/O 132CSBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 132-LFBGA, CSPBGA
- 庫存
- 1,327 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO2 |
| Supplier Device Package | 132-CSPBGA (8x8) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO2-4000HE-6MG132I 的主要供貨及採購資訊。
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LCMXO2-4000HE-6MG132I 詳細描述
Product Overview
The LCMXO2-4000HE-6MG132I from Lattice Semiconductor Corporation is a MachXO2 field programmable gate array intended for embedded digital logic design. The device uses a 132-LFBGA, CSPBGA package with a 132-CSPBGA (8x8) device package and is mounted by surface-mount assembly. It provides 104 I/O, 540 LABs/CLBs, 4320 logic elements/cells, and 94208 total RAM bits. The supply voltage range is 1.14V to 1.26V, and the operating temperature range is -40°C to 100°C at the junction. This FPGA can implement custom control logic, interface adaptation, and on-chip buffering within embedded systems.
Key Features
- MachXO2 FPGA architecture with 540 LABs/CLBs and 4320 logic elements/cells
- 104 I/O for external device connection
- 94208 total RAM bits for on-chip data storage
- 132-LFBGA, CSPBGA package with 132-CSPBGA (8x8) device package
- Surface-mount mounting type for PCB assembly
- Supply voltage range of 1.14V to 1.26V
- Operating temperature range of -40°C to 100°C (TJ)
Applications
- Embedded control logic implementation in digital systems
- Interface bridging between multiple external devices
- Digital sensor interface aggregation using the I/O and on-chip RAM
Design & Procurement Notes
When selecting this FPGA, plan the PCB land pattern for the 132-CSPBGA (8x8) surface-mount package and verify that the board power system can provide 1.14V to 1.26V. The 104 I/O, 540 LABs/CLBs, 4320 logic elements/cells, and 94208 total RAM bits define the programmable resources and on-chip storage. Thermal design should account for operation up to 100°C at the junction and down to -40°C. Final resource usage and I/O assignment should be confirmed before layout. The surface-mount package and junction temperature range should be considered during schematic and PCB design.
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