料號

LCMXO2-4000HE-4BG332I

IC FPGA 274 I/O 332CABGA

封裝
332-FBGA
庫存
1,498 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package Tray
Product status Active
Series MachXO2
Supplier Device Package 332-CABGA (17x17)
Voltage - Supply 1.14V ~ 1.26V
資料表 查看資料表PDF
採購資訊

採購概覽

LCMXO2-4000HE-4BG332I 的主要供貨及採購資訊。

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料號 LCMXO2-4000HE-4BG332I
供貨狀態 列示庫存 1,498 pcs 當前數量需確認。
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LCMXO2-4000HE-4BG332I 詳細描述

Product Overview

The Lattice Semiconductor Corporation LCMXO2-4000HE-4BG332I is an Active MachXO2 field programmable gate array supplied in a 332-CABGA (17x17) surface mount package. The device provides 274 I/O, 4320 logic elements or cells, 540 LABs or CLBs, and 94208 total RAM bits. Its supply voltage is specified as 1.14V ~ 1.26V, and its operating temperature range is -40°C ~ 100°C (TJ). These parameters define the core programmable logic resources and physical mounting characteristics for board-level integration.

Key Features

  • MachXO2 FPGA from Lattice Semiconductor Corporation with product status Active.
  • 332-CABGA (17x17) surface mount package with 274 I/O.
  • 4320 logic elements or cells and 540 LABs or CLBs.
  • 94208 total RAM bits.
  • Supply voltage range 1.14V ~ 1.26V.
  • Operating temperature range -40°C ~ 100°C (TJ).

Applications

  • Programmable logic implementation for custom digital control and routing functions in embedded systems.
  • Glue logic replacement for discrete logic devices in prototype and production hardware.
  • Custom peripheral expansion for microcontroller-based systems requiring programmable I/O mapping.
  • State-machine implementation for digital subsystems requiring configurable control logic.

Design & Procurement Notes

Designers should evaluate the 332-CABGA (17x17) footprint, 274 available I/O, 4320 logic elements or cells, and 94208 total RAM bits against the target board layout and logic capacity. The 1.14V ~ 1.26V supply requirement and -40°C ~ 100°C (TJ) operating range should be checked with the system power sequencing and thermal design. Because the part is a surface mount FPGA, surface mount assembly considerations should match the supplier device package. The Active status indicates the listed lifecycle state from the supplied data, while no qualification or replacement information is provided.

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