LCMXO2-4000HC-6BG332I

Product Overview

LCMXO2-4000HC-6BG332I is a MachXO2 field programmable gate array (FPGA) from Lattice Semiconductor Corporation, intended for embedded logic designs that require reconfigurable digital functions, configurable input/output behavior, and on-chip memory resources. The device uses a 332-CABGA (17x17) surface-mount package and provides 274 I/O pins, 4320 logic elements/cells, 540 LABs/CLBs, and 94208 total RAM bits. Its specified supply voltage range is 2.375V to 3.465V, and its junction temperature operating range is -40°C to 100°C, supporting designs where logic resources, I/O count, and package form factor are relevant system considerations.

Key Features

• MachXO2 field programmable gate array architecture supports configurable digital logic within embedded systems.
• Provides 4320 logic elements/cells and 540 LABs/CLBs for implementing state machines, control paths, and custom datapath functions.
• Includes 94208 total RAM bits for on-chip memory allocation in FPGA designs.
• Offers 274 I/O pins in a 332-CABGA (17x17) surface-mount package.
• Operates from a 2.375V to 3.465V supply and is specified for -40°C to 100°C junction temperature.

Applications

• Embedded control subsystems where custom digital logic and configurable input/output behavior coordinate on-board functions.
• Interface adaptation between different digital signals or buses, using available I/O resources to translate, buffer, or route logic states.
• Sensor and actuator aggregation designs that use configurable logic to combine multiple digital inputs and outputs into a control path.
• Memory-assisted data handling tasks that use on-chip RAM bits for temporary storage, queuing, or buffering within FPGA logic.

Design & Procurement Notes

Design teams selecting the LCMXO2-4000HC-6BG332I should plan for a 332-CABGA (17x17) surface-mount package, which requires appropriate land-pattern, soldering, and inspection processes. The 274 I/O pins, 4320 logic elements/cells, 540 LABs/CLBs, and 94208 total RAM bits should be mapped against the intended logic, memory, and connectivity requirements before finalizing the design. Power delivery should remain within the 2.375V to 3.465V supply range, and thermal design should consider the -40°C to 100°C junction temperature specification. These parameters are useful for evaluating board density, resource utilization, and operating environment suitability in embedded FPGA implementations.