LCMXO1200C-3BN256I
IC FPGA 211 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA, CSPBGA
- 庫存
- 1,365 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 1.71V ~ 3.465V |
| 資料表 | 查看資料表PDF |
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LCMXO1200C-3BN256I 的主要供貨及採購資訊。
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LCMXO1200C-3BN256I 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO1200C-3BN256I is a MachXO field programmable gate array (FPGA) for embedded logic implementation. It includes 1200 logic elements/cells, 150 LABs/CLBs, 9421 total RAM bits, and 211 I/O in a 256-LFBGA, CSPBGA package with 256-CABGA (14x14) package designation. The surface-mount device operates from 1.71 V to 3.465 V over a junction temperature range of -40°C to 100°C.
Key Features
- MachXO FPGA architecture with 1200 logic elements/cells and 150 LABs/CLBs.
- 211 I/O for external signal routing and interface expansion.
- 9421 total RAM bits for on-device data buffering and small memory structures.
- Supply voltage range of 1.71 V to 3.465 V.
- Operating temperature range of -40°C to 100°C (TJ).
- Surface-mount 256-LFBGA, CSPBGA package with 256-CABGA (14x14) package designation.
Applications
- Embedded control logic for systems that require configurable state machines and replacement of discrete glue logic.
- Sensor and peripheral data aggregation using the 211 I/O and 9421 total RAM bits.
- Digital interface adaptation and data path control between external devices.
- Timing, sequencing, and custom logic generation in embedded FPGA designs.
Design & Procurement Notes
For design and procurement, confirm that the required logic, I/O, and RAM resources are within 1200 logic elements/cells, 211 I/O, and 9421 total RAM bits. Supply rails must remain within 1.71 V to 3.465 V, and thermal design should consider the -40°C to 100°C (TJ) operating temperature range. Assembly planning should account for the surface-mount 256-LFBGA, CSPBGA package and the 256-CABGA (14x14) package designation when validating footprint, land pattern, and mechanical clearance. The MachXO series and FPGA function support configurable logic applications, but detailed timing, interface, and power sequencing should be verified against the device's technical documentation.
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