PART NUMBER

LCMXO1200C-3BN256I

IC FPGA 211 I/O 256CABGA

Quick Answer: The Lattice Semiconductor Corporation LCMXO1200C-3BN256I is a MachXO field programmable gate array (FPGA) for embedded logic implementation.

Package
256-LFBGA, CSPBGA
Stock
1,365 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer Lattice Semiconductor Corporation
Product Category FPGA - Field Programmable Gate Array
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package Tray
Product status Active
Series MachXO
Supplier Device Package 256-CABGA (14x14)
Voltage - Supply 1.71V ~ 3.465V
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for LCMXO1200C-3BN256I.

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Part Number LCMXO1200C-3BN256I
Availability 1,365 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
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Detailed Description for LCMXO1200C-3BN256I

Product Overview

The Lattice Semiconductor Corporation LCMXO1200C-3BN256I is a MachXO field programmable gate array (FPGA) for embedded logic implementation. It includes 1200 logic elements/cells, 150 LABs/CLBs, 9421 total RAM bits, and 211 I/O in a 256-LFBGA, CSPBGA package with 256-CABGA (14x14) package designation. The surface-mount device operates from 1.71 V to 3.465 V over a junction temperature range of -40°C to 100°C.

Key Features

  • MachXO FPGA architecture with 1200 logic elements/cells and 150 LABs/CLBs.
  • 211 I/O for external signal routing and interface expansion.
  • 9421 total RAM bits for on-device data buffering and small memory structures.
  • Supply voltage range of 1.71 V to 3.465 V.
  • Operating temperature range of -40°C to 100°C (TJ).
  • Surface-mount 256-LFBGA, CSPBGA package with 256-CABGA (14x14) package designation.

Applications

  • Embedded control logic for systems that require configurable state machines and replacement of discrete glue logic.
  • Sensor and peripheral data aggregation using the 211 I/O and 9421 total RAM bits.
  • Digital interface adaptation and data path control between external devices.
  • Timing, sequencing, and custom logic generation in embedded FPGA designs.

Design & Procurement Notes

For design and procurement, confirm that the required logic, I/O, and RAM resources are within 1200 logic elements/cells, 211 I/O, and 9421 total RAM bits. Supply rails must remain within 1.71 V to 3.465 V, and thermal design should consider the -40°C to 100°C (TJ) operating temperature range. Assembly planning should account for the surface-mount 256-LFBGA, CSPBGA package and the 256-CABGA (14x14) package designation when validating footprint, land pattern, and mechanical clearance. The MachXO series and FPGA function support configurable logic applications, but detailed timing, interface, and power sequencing should be verified against the device's technical documentation.

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