LCMXO1200E-5TN144C
IC FPGA 113 I/O 144TQFP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 144-LQFP
- 庫存
- 1,367 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 144-TQFP (20x20) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO1200E-5TN144C 的主要供貨及採購資訊。
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LCMXO1200E-5TN144C 詳細描述
Product Overview
The LCMXO1200E-5TN144C is a MachXO FPGA integrated circuit from Lattice Semiconductor Corporation, in a 144-LQFP package with a 144-TQFP (20 x 20) body. The device supports surface-mount embedded logic implementations and provides 1200 logic elements/cells, 150 LABs/CLBs, 9421 total RAM bits, and 113 I/O pins. Its supply voltage range is 1.14 V to 1.26 V, and its operating temperature range is 0°C to 85°C (TJ).
Key Features
- MachXO FPGA integrated circuit from Lattice Semiconductor Corporation
- 1200 logic elements/cells and 150 LABs/CLBs
- 9421 total RAM bits
- 113 I/O pins
- 144-LQFP package, 144-TQFP (20 x 20)
- Surface-mount mounting type
- 1.14 V to 1.26 V supply voltage range
- 0°C to 85°C (TJ) operating temperature range
Applications
- Embedded control logic using FPGA logic resources
- I/O expansion or glue logic in systems using a 144-LQFP FPGA
- Small buffering or lookup functions using available RAM bits
- Surface-mount embedded subsystems operating between 0°C and 85°C (TJ)
Design & Procurement Notes
Designers should verify that the board power supply can maintain the 1.14 V to 1.26 V supply range and that the thermal environment remains within 0°C to 85°C (TJ). The 144-LQFP / 144-TQFP (20 x 20) package and surface-mount mounting type require pad layout and assembly compatibility for the 144-LQFP form. The 1200 logic elements/cells, 9421 RAM bits, and 113 I/O pins should be compared with the target system's logic, memory, and I/O count requirements before finalizing the design. Because the operating temperature is specified as junction temperature (TJ), thermal design should account for the difference between ambient conditions and junction temperature.
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